Search results for: Copper Interconnect

Authors: Kureshi Abdul Kadir, Mohd. Hasan

Abstract:

Each new semiconductor technology node brings smaller transistors and wires. Although this makes transistors faster, wires get slower. In nano-scale regime, the standard copper (Cu) interconnect will become a major hurdle for FPGA interconnect due to their high resistivity and electromigration. This paper presents the comprehensive evaluation of mixed CNT bundle interconnects and investigates their prospects as energy efficient and high speed interconnect for future FPGA routing architecture. All HSPICE simulations are carried out at operating frequency of 1GHz and it is found that mixed CNT bundle implemented in FPGAs as interconnect can potentially provide a substantial delay and energy reduction over traditional interconnects at 32nm process technology.

Keywords: CMOS, Copper Interconnect, Mixed CNT Bundle Interconnect, FPGAs.

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Authors: S. N. Hosseini, M. H. Enayati, F. Karimzadeh, N. M. Sammes

Abstract:

The synthesis of CuFe2O4 spinel powders by an optimized combustion-like process followed by calcination is described herein. The samples were characterized using X-ray diffraction (XRD), differential thermal analysis (TG/DTA), scanning electron microscopy (SEM), dilatometry and 4-probe DC methods. Different glycine to nitrate (G/N) ratios of 1 (fuel-deficient), 1.48 (stoichiometric) and 2 (fuel-rich) were employed. Calcining the asprepared powders at 800 and 1000°C for 5 hours showed that the G/N ratio of 2 results in the formation of the desired copper spinel single phase at both calcination temperatures. For G/N=1, formation of CuFe2O4 takes place in three steps. First, iron and copper nitrates decompose to iron oxide and pure copper. Then, copper transforms to copper oxide and finally, copper and iron oxides react with each other to form a copper ferrite spinel phase. The electrical conductivity and the coefficient of thermal expansion of the sintered pelletized samples were 2 S.cm-1 (800°C) and 11×10-6 °C-1 (25-800°C), respectively.

Keywords: SOFC interconnect coatings, Copper ferrite, Spinels, Electrical conductivity, Glycine–nitrate process.

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Authors: Shilpi Lavania

Abstract:

As the frequency of operation has attained a range of GHz and signal rise time continues to increase interconnect technology is suffering due to various high frequency effects as well as ground bounce problem. In some recent studies a high frequency effect i.e. skin effect has been modeled and its drawbacks have been discussed. This paper strives to make an impression on the advantage side of modeling skin effect for interconnect line. The proposed method has considered a CMOS with RC interconnect. Delay and noise considering ground bounce problem and with skin effect are discussed. The simulation results reveal an advantage of considering skin effect for minimization of ground bounce problem during the working of the model. Noise and delay variations with temperature are also presented.

Keywords: Interconnect, Skin effect, Ground Bounce, Delay, Noise.

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Authors: Guang Sun, Yong Li, Yuanyuan Zhang, Shijun Lin, Li Su, Depeng Jin, Lieguang zeng

Abstract:

Network on Chip (NoC) has emerged as a promising on chip communication infrastructure. Three Dimensional Integrate Circuit (3D IC) provides small interconnection length between layers and the interconnect scalability in the third dimension, which can further improve the performance of NoC. Therefore, in this paper, a hierarchical cluster-based interconnect architecture is merged with the 3D IC. This interconnect architecture significantly reduces the number of long wires. Since this architecture only has approximately a quarter of routers in 3D mesh-based architecture, the average number of hops is smaller, which leads to lower latency and higher throughput. Moreover, smaller number of routers decreases the area overhead. Meanwhile, some dual links are inserted into the bottlenecks of communication to improve the performance of NoC. Simulation results demonstrate our theoretical analysis and show the advantages of our proposed architecture in latency, throughput and area, when compared with 3D mesh-based architecture.

Keywords: Network on Chip (NoC), interconnect architecture, performance, area, Three Dimensional Integrate Circuit (3D IC).

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Authors: Jong-Bae Lee, Seongsoo Lee

Abstract:

Local interconnect network (LIN) is a communication protocol that combines sensors, actuators, and processors to a functional module in automotive applications. In this paper, a LIN ver. 2.2A controller was designed in Verilog hardware description language (Verilog HDL) and implemented in field-programmable gate array (FPGA). Its operation was verified by making full-scale LIN network with the presented FPGA-implemented LIN controller, commercial LIN transceivers, and commercial processors. When described in Verilog HDL and synthesized in 0.18 μm technology, its gate size was about 2,300 gates.

Keywords: Local interconnect network, controller, transceiver, processor.

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Authors: G.Ramana Murthy, C.Senthilpari, P.Velrajkumar, Lim Tien Sze

Abstract:

The proposed multiplexer-based novel 1-bit full adder cell is schematized by using DSCH2 and its layout is generated by using microwind VLSI CAD tool. The adder cell layout interconnect analysis is performed by using BSIM4 layout analyzer. The adder circuit is compared with other six existing adder circuits for parametric analysis. The proposed adder cell gives better performance than the other existing six adder circuits in terms of power, propagation delay and PDP. The proposed adder circuit is further analyzed for interconnect analysis, which gives better performance than other adder circuits in terms of layout thickness, width and height.

Keywords: Full Adder, Interconnect Analysis, Low-Power, Multiplexer, Propagation Delay, Parametric Analysis.

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Authors: Kollarama Subramanyam, Nisha Kuruvilla, J. P. Raina

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Novel compact expressions for propagation constant (γ) of SWCNT and bundled SWCNTs interconnect, in terms of physical parameters such as length, operating frequency and diameter of CNTs is proposed in this work. These simplified expressions enable physical insight and accurate estimation of signal attenuation level and its phase change at any length for a particular frequency. The proposed expressions are validated against SPICE simulated results of lumped as well as distributed equivalent electrical RLC nets of CNT interconnect. These expressions also help us to evaluate the cut off frequencies of SWCNTs for different interconnect lengths.

Keywords: Attenuation constant, Bundled SWCNT, CNT interconnects, Propagation Constant.

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Authors: Tebogo P. Phetla, Edison Muzenda

Abstract:

This study was carried out to develop a flotation procedure for an oxide copper ore from a Region in Central Africa for producing an 18% copper concentrate for downstream processing at maximum recovery from a 4% copper feed grade. The copper recoveries achieved from the test work were less than 50% despite changes in reagent conditions (multistage sulphidisation, use of RCA emulsion and mixture, use of AM 2, etc). The poor recoveries were attributed to the mineralogy of the ore from which copper silicates accounted for approximately 70% (mass) of the copper minerals in the ore. These can be complex and difficult to float using conventional flotation methods. Best results were obtained using basic sulphidisation procedures, a high flotation temperature and extended flotation residence time.

Keywords: Froth flotation, Sulphidisation, Copper oxide ore, Mineralogy, Recovery

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Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

Abstract:

Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.

Keywords: Delay Modelling; On-Chip Interconnect; RLCGInterconnect; Ramp Input; Damping; VLSI

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Authors: E. Moroydor Derun, N. Tugrul, F. T. Senberber, A. S. Kipcak, S. Piskin

Abstract:

In this research, copper borates are synthesized by the reaction of copper sulfate pentahydrate (CuSO4.5H2O) and tincalconite (Na2O4B7.10H2O). The experimental parameters are selected as 80oC reaction temperature and 60 of reaction time. The effect of mole ratio of CuSO4.5H2O to Na2O4B7.5H2O is studied. For the identification analyses X-Ray Diffraction (XRD) and Fourier Transform Infrared Spectroscopy (FT-IR) techniques are used. At the end of the experiments, synthesized copper borate is matched with the powder diffraction file of “00-001-0472” [Cu(BO2)2] and characteristic vibrations between B and O atoms are seen. The proper crystals are obtained at the mole ratio of 3:1. This study showed that simplified synthesis process is suitable for the production of copper borate minerals.

Keywords: Hydrothermal synthesis, copper borates, copper sulfate, tincalconite.

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Authors: Robert Prucek, Aleš Panáček, Jan Filip, Libor Kvítek, Radek Zbořil

Abstract:

The preparation of Cu nanoparticles (NPs) through the reduction of copper ions by sodium borohydride in the presence of sodium polyacrylate with a molecular weight of 1200 is reported. Cu NPs were synthesized at a concentration of copper salt equal to 2.5, 5, and 10 mM, and at a molar ratio of copper ions and monomeric unit of polyacrylate equal to 1:2. The as-prepared Cu NPs have diameters of about 2.5–3 nm for copper concentrations of 2.5 and 5 mM, and 6 nm for copper concentration of 10 mM. Depending on the copper salt concentration and concentration of additionally added polyacrylate to Cu particle dispersion, primarily formed NPs grow through the process of aggregation and/or coalescence into clusters and/or particles with a diameter between 20–100 nm. The amount of additionally added sodium polyacrylate influences the stability of Cu particles against air oxidation. The catalytic efficiency of the prepared Cu particles for the reduction of 4-nitrophenol is discussed.

Keywords: Copper, nanoparticles, sodium polyacrylate, catalyst, 4-nitrophenol.

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Authors: May Thant Zin, Josephine Borja, Hirofumi Hinode, Winarto Kurniawan

Abstract:

Nanotechnology has multiple and enormous advantages for all application. Therefore, this research is carried out to synthesize and characterize bimetallic iron with copper nanoparticles. After synthesizing nano zero valent iron by reduction of ferric chloride by sodium borohydride under nitrogen purging environment, bimetallic iron with copper nanoparticles are synthesized by varying different loads of copper chloride. Due to different standard potential (E⁰) values of copper and iron, copper is coupled with iron at (Cu to Fe ratio of 1:5, 1:6.7, 1:10, 1:20). It is found that the resulted bimetallic Fe/Cu nanoparticles are composing phases of iron and copper. According to the diffraction patterns indicating the state of chemical combination of the bimetallic nanoparticles, the particles are well-combined and crystalline sizes are less than 1000A^o (or 100nm). Specifically, particle sizes of synthesized bimetallic Fe/Cu nanoparticles are ranging from 44.583 nm to 85.149 nm.

Keywords: Bimetallic Fe/Cu nanoparticles, Loading ratio, Synthesis.

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Authors: John Kabuba, Hilary Rutto

Abstract:

Ion exchange is one of the methods used to remove heavy metal such as copper and cobalt from wastewaters. Parameters affecting the ion-exchange of copper and cobalt aqueous solutions using clinoptilolite are the objectives of this study. Synthetic solutions were prepared with the concentration of 0.02M, 0.06M and 0.1M. The cobalt solution was maintained to 0.02M while varying the copper solution to the above stated concentrations. The clinoptilolite was activated with HCl and H₂SO₄ for removal efficiency. The pHs of the solutions were found to be acidic hence enhancing the copper and cobalt removal. The natural clinoptilolite performance was also found to be lower compared to the HCl and H₂SO₄ activated one for the copper removal ranging from 68% to 78% of Cu²⁺ uptake with the natural clinoptilolite to 66% to 51% with HCl and H₂SO₄ respectively. It was found that the activated clinoptilolite removed more copper and cobalt than the natural one and found that the electronegativity of the metal plays a role in the metal removal and the clinoptilolite selectivity.

Keywords: Clinoptilolite, cobalt and copper, Ion-exchange, mass dosage, pH.

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Authors: Sunil Jadav, Rajeevan Chandel Munish Vashishath

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Today’s VLSI networks demands for high speed. And in this work the compact form mathematical model for current mode signalling in VLSI interconnects is presented.RLC interconnect line is modelled using characteristic impedance of transmission line and inductive effect. The on-chip inductance effect is dominant at lower technology node is emulated into an equivalent resistance. First order transfer function is designed using finite difference equation, Laplace transform and by applying the boundary conditions at the source and load termination. It has been observed that the dominant pole determines system response and delay in the proposed model. The novel proposed current mode model shows superior performance as compared to voltage mode signalling. Analysis shows that current mode signalling in VLSI interconnects provides 2.8 times better delay performance than voltage mode. Secondly the damping factor of a lumped RLC circuit is shown to be a useful figure of merit.

Keywords: Current Mode, Voltage Mode, VLSI Interconnect.

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Authors: George Eduful, Kingsford J. A. Atanga

Abstract:

Copper clad steel wire (CCS) is primarily used for grounding applications to reduce the high incidence of copper ground conductor theft in electrical installations. The cross sectional area of the CCS is selected by relating the diameter equivalence to a copper conductor. The main difficulty is how to use a simple analytical relation to determine the right conductivity of CCS for a particular application. The use of Eddy-Current instrument for measuring conductivity is known but in most cases, the instrument is not readily available. The paper presents a simplified approach on how to size and determine CCS conductivity for a given application.

Keywords: Copper clad steel wire, conductivity, grounding, skin effect.

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Authors: Mercy M. Ramakokovhu, Henry Kasaini, Richard K.K. Mbaya

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The copper flotation tailings from Konkola Copper mine in Nchanga, Zambia were used in the study. The purpose of this study was to determine the leaching characteristics of the tailings material prior and after the physical beneficiation process is employed. The Knelson gravity concentrator (KC-MD3) was used for the beneficiation process. The copper leaching efficiencies and impurity co-extraction percentages in both the upgraded and the raw feed material were determined at different pH levels and temperature. It was observed that the copper extraction increased with an increase in temperature and a decrease in pH levels. In comparison to the raw feed sample, the upgraded sample reported a maximum copper extraction of 69% which was 9%, higher than raw feed % extractions. The impurity carry over was reduced from 18% to 4 % on the upgraded sample. The reduction in impurity co-extraction was as a result of the removal of the reactive gangue elements during the upgrading process, this minimized the number of side reaction occurring during leaching.

Keywords: Atmospheric leaching, Copper, Iron, Knelson concentrator

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Authors: Susmita Sahoo, Madhumanti Datta, Rajib Kar

Abstract:

This work proposes an accurate crosstalk noise estimation method in the presence of multiple RLC lines for the use in design automation tools. This method correctly models the loading effects of non switching aggressors and aggressor tree branches using resistive shielding effect and realistic exponential input waveforms. Noise peak and width expressions have been derived. The results obtained are at good agreement with SPICE results. Results show that average error for noise peak is 4.7% and for the width is 6.15% while allowing a very fast analysis.

Keywords: Crosstalk, distributed RLC segments, On-Chip interconnect, output response, VLSI, noise peak, noise width.

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Authors: Travis J. Meyer, Jasodra Ramlall, Phyo Thu, Nidhi Gadura

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For centuries humans have used the antimicrobial properties of copper to their advantage. Yet, after all these years the underlying mechanisms of copper mediated cell death in various microbes remain unclear. We had explored the hypothesis that copper mediated increased levels of lipid peroxidation in the membrane fatty acids is responsible for increased killing in Escherichia coli. In this study we show that in both gram positive (Staphylococcus aureus) and gram negative (Pseudomonas aeruginosa) bacteria there is a strong correlation between copper mediated cell death and increased levels of lipid peroxidation. Interestingly, the non-spore forming gram positive bacteria as well as gram negative bacteria show similar patterns of cell death, increased levels of lipid peroxidation, as well as genomic DNA degradation, however there is some difference in loss in membrane integrity upon exposure to copper alloy surface.

Keywords: Antimicrobial, copper, gram positive, gram negative.

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Authors: M. İskefiyeli, İ. Özçelik

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PROFIBUS (PROcess FIeld BUS) which is defined with international standarts (IEC61158, EN50170) is the most popular fieldbus, and provides a communication between industrial applications which are located in different control environment and location in manufacturing, process and building automation. Its communication speed is from 9.6 Kbps to 12 Mbps over distances from 100 to 1200 meters, and so it is to be often necessary to interconnect them in order to break these limits. Unfortunately this interconnection raises several issues and the solutions found so far are not very satisfactory. In this paper, we propose a new solution to interconnect PROFIBUS segments, which uses a wireless MAN based on the IEEE 802.16 standard as a backbone system. Also, the solution which is described a model for internetworking unit integrates the traffic generated by PROFIBUS segments into IEEE 802.16 wireless MAN using encapsulation technique.

Keywords: Internetworking Unit, PROFIBUS, WiMAX, WMAN, 802.16.

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Authors: M. Lamri Zeggar, F. Bourfaa, A. Adjimi, F. Boutbakh, M. S. Aida, N. Attaf

Abstract:

CuO thin films were deposited by spray ultrasonic pyrolysis with different precursor solution. Two staring solution slats were used namely: copper acetate and copper chloride. The influence of these solutions on CuO thin films proprieties of is instigated. The X rays diffraction (XDR) analysis indicated that the films deposed with copper acetate are amorphous however the films elaborated with copper chloride have monoclinic structure. UV- Visible transmission spectra showed a strong absorbance of the deposited CuO thin films in the visible region. Electrical characterization has shown that CuO thin films prepared with copper acetate have a higher electrical conductivity.

Keywords: Thin films, cuprous oxide, spray pyrolysis, precursor solution.

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Authors: Zhypargul Abdullaeva, Emil Omurzak, Tsutomu Mashimo

Abstract:

Copper sulfide nanoparticles (CuS) were successfully synthesized by the pulsed plasma in liquid method, using two copper rod electrodes submerged in molten sulfur. Low electrical energy and no high temperature were applied for synthesis. Obtained CuS nanoparticles were then analyzed by means of X-ray diffraction, Low and High Resolution Transmission Electron Microscopy, Electron Diffraction, X-ray Photoelectron, Raman Spectroscopies and Field Emission Scanning Electron Microscopy. XRD analysis revealed peaks for CuS with hexagonal phase composition. TEM and HRTEM studies showed that sizes of CuS nanoparticles ranged between 10-60 nm, with the average size of about 20 nm. Copper sulfide nanoparticles have short nanorod-like structure. Raman spectroscopy found peak for CuS at 474.2cm-1of Raman region.

Keywords: Copper sulfide, Nanoparticles, Pulsed plasma, Synthesis.

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Authors: Turan Çalban, Oral Laçin, Abdüsselam Kurtbas

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Experimental production methods of Chevreul’s salt being an intermediate stage product in copper recovery were investigated on this article. Chevreul’s salt, Cu2SO3.CuSO3.2H2O, being a mixed valence copper sulphite compound, has been obtained by using different methods and reagents. Chevreul’s salt has an intense brick-red color. It is highly stable and expensive. The production of Chevreul’s salt plays a key role in hydrometallurgy. Thermodynamic tendency on precipitation of Chevreul’s salt is related to pH and temperature. Besides, SO2 gaseous is a versatile reagent for precipitating of copper sulphites, Using of SO2 for selective precipitation can be made by appropriate adjustments of pH and temperature. Chevreul’s salt does not form in acidic solutions if those solutions contains considerable amount of sulfurous acid. It is necessary to maintain between pH 2–4.5, because, solubility of Chevreul’s salt increases with decreasing of pH values. Also, the region which Chevreul’s salt is stable can be seen from the potentialpH diagram.

Keywords: Chevreul’s salt, copper recovery, copper sulphite, stage product.

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Authors: Arunrungrusmi S, Chaokamnerd W, Tanitteerapan T, Mungkung N., Yuji T.

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The purpose of this research was to analyze and compare the instability of a contact surface between Copper and Nickel an alloy cathode in vacuum, the different ratio of Copper and Copper were conducted at 1%, 2% and 4% by using the cathode spot model. The transient recovery voltage is predicted. The cathode spot region is recognized as the collisionless space charge sheath connected with singly ionized collisional plasma. It was found that the transient voltage is decreased with increasing the percentage of an amount of Nickel in cathode materials.

Keywords: Vacuum arc, Instability, Low current, Cathode spot, copper, Nickel, Transient Recovery Voltage.

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Authors: Turan Çalban, Fatih Sevim, Oral Laçin

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In this study, the precipitation conditions of Chevreul’s salt were evaluated. The structure of Chevreul’s salt was examined by considering the previous studies. Thermodynamically, the most important precipitation parameters were pH, temperature, and sulphite-copper(II) ratio. The amount of Chevreul’s salt increased with increasing the temperature and sulphite-copper(II) ratio at the certain range, while it increased with decreasing the pH value at the chosen range. The best solution medium for recovery of Chevreul’s salt is sulphur dioxide gas-water system. Moreover, the soluble sulphite salts are used as efficient precipitating reagents. Chevreul’s salt is generally used to produce the highly pure copper powders from synthetic copper sulphate solutions and impure leach solutions. When the pH of the initial ammoniacal solution is greater than 8.5, ammonia in the medium is not free, and Chevreul’s salt from solution does not precipitate. In contrast, copper ammonium sulphide is precipitated. The pH of the initial solution containing ammonia for precipitating of Chevreul’s salt must be less than 8.5.

Keywords: Chevreul’s salt, copper sulphites, mixed-valence sulphite compounds, precipitating.

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Authors: Mouna Mallem, Majid Tlidjane

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The study realized on alive lambs in two different areas mountain and plain in Batna region, aims to demonstrate the possible effect of field type on cupric status of lambs, through evaluation of copper contents in the chain: soil – plant – animal by atomic absorption spectrophotometry. This comparative study also allowed the investigation of the influence of the age and the season. The results obtained show that contents of copper in the soil, forage in the same way as in the plasma of lambs are higher in the plain than in the mountainous area; however, the difference is significant only between the values of feed.

Keywords: Copper, Forage, Lambs, Plasma copper.

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Authors: J. Bertrandt, A. Kłos, R. Waszkowski, T. Nowicki, R. Pytlak, E. Stęzycka, A. Gazdzinska

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 The aim of the work was estimation of copper intake with the daily food rations used for alimentation of students of military high schools and soldiers doing compulsory military service in the Polish Army. An average planned copper content in daily food rations used for alimentation of students and soldiers amounted to 2.49±0.35 mg, and 2.44±0.25 mg respectively. The copper content in the daily food ration given for consumption to students amounted from 1.81±0.14 mg to 2.58±0.44 mg while daily food rations served to soldiers delivered from 2.06±0.45 mg to 2.13±0.33 mg. The copper content in the rations planned for students and soldiers alimentation was within the limits of the norms obligatory in Poland. Daily food rations given for consumption, except rations served for students, were within the limits of the recommended norms, but food rations really eaten by examined men didn’t cover the requirements for copper.

Keywords: Copper, daily food ration, military service.

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Authors: Dhananjayulu Avula, Ratnesh Kumar Raj Singh, D.K.Dwivedi, N.K.Mehta

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This study demonstrates the feasibility of joining the commercial pure copper plates by friction stir welding (FSW). Microstructure, microhardness and tensile properties in terms of the joint efficiency were found 94.03 % compare to as receive base material (BM). The average hardness at the top was higher than bottom. Hardness of weld zone was higher than the base material. Different microstructure zones were revealed by optical microscopy and scanning electron microscopy. The stirred zone (SZ) exhibited primary two phases namely, recrystallized grains and fine precipitates in matrix of copper.

Keywords: Welding; FSW, Commercial Copper, Mechanical properties

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Authors: Haidy S. Ghali, Engy Serag, A. Samer Ezeldin

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Copper is an essential raw material used in the construction industry. During 2021 and the first half of 2022, the global market suffered from a significant fluctuation in copper raw material prices due to the aftermath of both the COVID-19 pandemic and the Russia-Ukraine war which exposed its consumers to an unexpected financial risk. Thereto, this paper aims to develop two hybrid price prediction models using artificial neural network and long short-term memory (ANN-LSTM), by Python, that can forecast the average monthly copper prices, traded in the London Metal Exchange; the first model is a multivariate model that forecasts the copper price of the next 1-month and the second is a univariate model that predicts the copper prices of the upcoming three months. Historical data of average monthly London Metal Exchange copper prices are collected from January 2009 till July 2022 and potential external factors are identified and employed in the multivariate model. These factors lie under three main categories: energy prices, and economic indicators of the three major exporting countries of copper depending on the data availability. Before developing the LSTM models, the collected external parameters are analyzed with respect to the copper prices using correlation, and multicollinearity tests in R software; then, the parameters are further screened to select the parameters that influence the copper prices. Then, the two LSTM models are developed, and the dataset is divided into training, validation, and testing sets. The results show that the performance of the 3-month prediction model is better than the 1-month prediction model; but still, both models can act as predicting tools for diverse economic situations.

Keywords: Copper prices, prediction model, neural network, time series forecasting.

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Authors: Alina Anton, Gheorghe Solcan, Carmen Solcan

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The influence of copper and zinc supplements on milk production performances and health indicators was tested in a 20- week feeding trial, with 40 Holstein-Friesian lactating cows, devided in four groups (copper, zinc, copper-zinc and control). Correlations of the Cu and Zn plasma values with some animal performance criteria of health (body condition score and somatic cell counts) and production (milk yield, peak milk yield, fat and crude protein content) were done. During the 140 days of the experiment, the two added minerals caused a statistically significant increase (p < 0.05) of their plasma values after the peak of the cows’ lactations. It was also observed that subjects that have received copper and zinc supplements had the lowest number of somatic cell counts in milk. The Pearson correlation test showed a positive corellation (p = 0.007, r = + 0.851) between the plasma Zn and the milk production. The improvement of the nutritional status improved the milk production performances of the cows as well as their health performances.

Keywords: Copper, dairy cows, health, milk production, zinc

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Authors: S K Sharma, N S Sehkon, S Deswal, Siby John

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The presence of toxic heavy metals in industrial effluents is one of the serious threats to the environment. Heavy metals such as Cadmium, Chromium, Lead, Nickel, Zinc, Mercury, Copper, Arsenic are found in the effluents of industries such as foundries, electroplating, petrochemical, battery manufacturing, tanneries, fertilizer, dying, textiles, metallurgical and metal finishing. Tremendous increase of industrial copper usage and its presence in industrial effluents has lead to a growing concern about the fate and effects of Copper in the environment. Percolation of industrial effluents through soils leads to contamination of ground water and soils. The transport of heavy metals and their diffusion into the soils has therefore, drawn the attention of the researchers. In this study, an attempt has been made to delineate the mechanisms of transport and fate of copper in terrestrial environment. Column studies were conducted using perplex glass square column of dimension side 15 cm and 1.35 m long. The soil samples were collected from a natural drain near Mohali (India). The soil was characterized to be poorly graded sandy loam. The soil was compacted to the field dry density level of about 1.6 g/cm3. Break through curves for different depths of the column were plotted. The results of the column study indicated that the copper has high tendency to flow in the soils and fewer tendencies to get absorbed on the soil particles. The t1/2 estimates obtained from the studies can be used for design copper laden wastewater disposal systems.

Keywords: Column study, copper, soil, transport.

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