Kai Huang

Publications

1 Five-axis Strip Machining with Barrel Cutter Based On Tolerance Constraint for Sculptured Surfaces

Authors: LiMin Zhu, YaoAn Lu, QingZhen Bi, BaoRui Du, ShuLin Chen, Kai Huang

Abstract:

Taking the design tolerance into account, this paper presents a novel efficient approach to generate iso-scallop tool path for five-axis strip machining with a barrel cutter. The cutter location is first determined on the scallop surface instead of the design surface, and then the cutter is adjusted to locate the optimal tool position based on the differential rotation of the tool axis and satisfies the design tolerance simultaneously. The machining strip width and error are calculated with the aid of the grazing curve of the cutter. Based on the proposed tool positioning algorithm, the tool paths are generated by keeping the scallop height formed by adjacent tool paths constant. An example is conducted to confirm the validity of the proposed method.

Keywords: Strip machining, barrel cutter, iso-scallop tool path, sculptured surfaces, differential motion

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Abstracts

1 Copper Doped P-Type Nickel Oxide Transparent Conducting Oxide Thin Films

Authors: Kai Huang, Assamen Ayalew Ejigu, Mu-Jie Lin, Liang-Chiun Chao

Abstract:

Nickel oxide and copper-nickel oxide thin films have been successfully deposited by reactive ion beam sputter deposition. Experimental results show that nickel oxide deposited at 300°C is single phase NiO while best crystalline quality is achieved with an O_pf of 0.5. XRD analysis of nickel-copper oxide deposited at 300°C shows a Ni2O3 like crystalline structure at low O_pf while changes to NiO like crystalline structure at high O_pf. EDS analysis shows that nickel-copper oxide deposited at low O_pf is CuxNi2-xO3 with x = 1, while nickel-copper oxide deposited at high O_pf is CuxNi1-xO with x = 0.5, which is supported by Raman analysis. The bandgap of NiO is ~ 3.5 eV regardless of O_pf while the band gap of nickel-copper oxide decreases from 3.2 to 2.3 eV as Opf reaches 1.0.

Keywords: Copper, resistivity, oxide, NiO, transparent, ion beam

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