Hyu Sang Jo

Publications

1 Thermal Expansion Coefficient and Young’s Modulus of Silica-Reinforced Epoxy Composite

Authors: Hyu Sang Jo, Gyo Woo Lee

Abstract:

In this study, the evaluation of thermal stability of the micrometer-sized silica particle reinforced epoxy composite was carried out through the measurement of thermal expansion coefficient and Young’s modulus of the specimens. For all the specimens in this study from the baseline to those containing 50 wt% silica filler, the thermal expansion coefficients and the Young’s moduli were gradually decreased down to 20% and increased up to 41%, respectively. The experimental results were compared with fillervolume- based simple empirical relations. The experimental results of thermal expansion coefficients correspond with those of Thomas’s model which is modified from the rule of mixture. However, the measured result for Young’s modulus tends to be increased slightly. The differences in increments of the moduli between experimental and numerical model data are quite large.

Keywords: Thermal Stability, silica-reinforced, coefficient of thermal expansion, empirical model, Epoxy Composite

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Abstracts

2 Thermal Property Improvement of Silica Reinforced Epoxy Composite Specimens

Authors: Hyu Sang Jo, Gyo Woo Lee

Abstract:

In this study, the mechanical and thermal properties of epoxy composites that are reinforced with micrometer-sized silica particles were investigated by using the specimen experiments. For all specimens used in this study (from the baseline to specimen containing 70 wt% silica filler), the tensile strengths were gradually increased by 8-10%, but the ductility of the specimen was decreased by 34%, compared with those of the baseline samples. Similarly, for the samples containing 70 wt% silica filler, the coefficient of thermal expansion was reduced by 25%, but the thermal conductivity was increased by 100%, compared with those of the baseline samples. The improvement of thermal stability of the silica-reinforced specimen was confirmed to be within the experimented range, and the smaller silica particle was found to be more effective in delaying the thermal expansion of the specimens. When the smaller particle was used as filler, due to the increased specific interface area between filler and matrix, the thermal conductivities of the composite specimens were measured to be slightly lower than those of the specimens reinforced with the larger particle.

Keywords: thermal property, epoxy composite, carbon nanotube filler, mechanical property

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1 Thermal Expansion Coefficient and Young’s Modulus of Silica-Reinforced Epoxy Composite

Authors: Hyu Sang Jo, Gyo Woo Lee

Abstract:

In this study, the evaluation of thermal stability of the micrometer-sized silica particle reinforced epoxy composite was carried out through the measurement of thermal expansion coefficient and Young’s modulus of the specimens. For all the specimens in this study from the baseline to those containing 50 wt% silica filler, the thermal expansion coefficients and the Young’s moduli were gradually decreased down to 20% and increased up to 41%, respectively. The experimental results were compared with filler-volume-based simple empirical relations. The experimental results of thermal expansion coefficients correspond with those of Thomas’s model which is modified from the rule of mixture. However, the measured result for Young’s modulus tends to be increased slightly. The differences in increments of the moduli between experimental and numerical model data are quite large.

Keywords: Thermal Stability, silica-reinforced, epoxy composite, coefficient of thermal expansion, empirical model

Procedia PDF Downloads 131