Alexander Verl

Publications

2 Determining the Width and Depths of Cut in Milling on the Basis of a Multi-Dexel Model

Authors: Alexander Verl, Jens Friedrich, Matthias A. Gebele, Armin Lechler

Abstract:

Chatter vibrations and process instabilities are the most important factors limiting the productivity of the milling process. Chatter can leads to damage of the tool, the part or the machine tool. Therefore, the estimation and prediction of the process stability is very important. The process stability depends on the spindle speed, the depth of cut and the width of cut. In milling, the process conditions are defined in the NC-program. While the spindle speed is directly coded in the NC-program, the depth and width of cut are unknown. This paper presents a new simulation based approach for the prediction of the depth and width of cut of a milling process. The prediction is based on a material removal simulation with an analytically represented tool shape and a multi-dexel approach for the workpiece. The new calculation method allows the direct estimation of the depth and width of cut, which are the influencing parameters of the process stability, instead of the removed volume as existing approaches do. The knowledge can be used to predict the stability of new, unknown parts. Moreover with an additional vibration sensor, the stability lobe diagram of a milling process can be estimated and improved based on the estimated depth and width of cut.

Keywords: Milling, dexel, process stability, material removal

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1 Development and Optimization of Automated Dry-Wafer Separation

Authors: Tim Giesen, Christian Fischmann, Fabian Böttinger, Alexander Ehm, Alexander Verl

Abstract:

In a state-of-the-art industrial production line of photovoltaic products the handling and automation processes are of particular importance and implication. While processing a fully functional crystalline solar cell an as-cut photovoltaic wafer is subject to numerous repeated handling steps. With respect to stronger requirements in productivity and decreasing rejections due to defects the mechanical stress on the thin wafers has to be reduced to a minimum as the fragility increases by decreasing wafer thicknesses. In relation to the increasing wafer fragility, researches at the Fraunhofer Institutes IPA and CSP showed a negative correlation between multiple handling processes and the wafer integrity. Recent work therefore focused on the analysis and optimization of the dry wafer stack separation process with compressed air. The achievement of a wafer sensitive process capability and a high production throughput rate is the basic motivation in this research.

Keywords: Automation, material handling, Photovoltaic Manufacturing, Thin Wafer

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Abstracts

2 Application of Additive Manufacturing for Production of Optimum Topologies

Authors: Alexander Verl, Armin Lechler, Mahdi Mottahedi, Peter Zahn

Abstract:

Optimal topology of components leads to the maximum stiffness with the minimum material use. For the generation of these topologies, normally algorithms are employed, which tackle manufacturing limitations, at the cost of the optimal result. The global optimum result with penalty factor one, however, cannot be fabricated with conventional methods. In this article, an additive manufacturing method is introduced, in order to enable the production of global topology optimization results. For a benchmark, topology optimization with higher and lower penalty factors are performed. Different algorithms are employed in order to interpret the results of topology optimization with lower factors in many microstructure layers. These layers are then joined to form the final geometry. The algorithms’ benefits are then compared experimentally and numerically for the best interpretation. The findings demonstrate that by implementation of the selected algorithm, the stiffness of the components produced with this method is higher than what could have been produced by conventional techniques.

Keywords: Additive manufacturing, topology optimization, laminated object manufacturing

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1 Determining the Width and Depths of Cut in Milling on the Basis of a Multi-Dexel Model

Authors: Alexander Verl, Jens Friedrich, Matthias A. Gebele, Armin Lechler

Abstract:

Chatter vibrations and process instabilities are the most important factors limiting the productivity of the milling process. Chatter can leads to damage of the tool, the part or the machine tool. Therefore, the estimation and prediction of the process stability is very important. The process stability depends on the spindle speed, the depth of cut and the width of cut. In milling, the process conditions are defined in the NC-program. While the spindle speed is directly coded in the NC-program, the depth and width of cut are unknown. This paper presents a new simulation based approach for the prediction of the depth and width of cut of a milling process. The prediction is based on a material removal simulation with an analytically represented tool shape and a multi-dexel approach for the work piece. The new calculation method allows the direct estimation of the depth and width of cut, which are the influencing parameters of the process stability, instead of the removed volume as existing approaches do. The knowledge can be used to predict the stability of new, unknown parts. Moreover with an additional vibration sensor, the stability lobe diagram of a milling process can be estimated and improved based on the estimated depth and width of cut.

Keywords: Milling, dexel, process stability, material removal

Procedia PDF Downloads 395