N. Singh

Publications

7 Monitoring of Water Pollution and Its Consequences: An Overview

Authors: N. Singh, N. Sharma, J. K. Katnoria

Abstract:

Water a vital component for all living forms is derived from variety of sources, including surface water (rivers, lakes, reservoirs and ponds) and ground water (aquifers). Over the years of time, water bodies are subjected to human interference regularly resulting in deterioration of water quality. Therefore, pollution of water bodies has become matter of global concern. As the water quality closely relate to human health, water analysis before usage is of immense importance. Improper management of water bodies can cause serious problems in availability and quality of water. The quality of water may be described according to their physico-chemical and microbiological characteristics. For effective maintenance of water quality through appropriate control measures, continuous monitoring of metals, physico-chemical and biological parameter is essential for the establishment of baseline data for the water quality in any study area. The present study has focused on to explore the status of water pollution in various areas and to estimate the magnitude of its toxicity using different bioassay.

Keywords: Heavy Metals, Genotoxicity, physico-chemical analysis, mutagenicity

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6 Low Frequency Noise Behavior of Independent Gate Junctionless FinFET

Authors: A. Kamath, Z. X. Chen, C. J. Gu, F. Zheng, X. P. Wang, N. Singh, G-Q. Lo

Abstract:

In this paper we use low frequency noise analysis to understand and map the current conduction path in a multi gate junctionless FinFET.  The device used in this study behaves as a gated resistor and shows excellent short channel effect suppression due to its multi gate structure. Generally for a bulk conduction device like the junctionless device studied in this work, the low frequency noise can be modelled using the mobility fluctuation model; however for this device we can also see the effect of carrier fluctuations on the LFN characteristic. The noise characteristic at different gate bias and also the possible location of the traps is explained.

Keywords: FinFET, junctionless, LFN analysis, Current conduction path

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5 Silicon Nanowire for Thermoelectric Applications: Effects of Contact Resistance

Authors: Y. Li, K. Buddharaju, N. Singh, G. Q. Lo, S. J. Lee

Abstract:

Silicon nanowire (SiNW) based thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting. It is a great challenge however, to assemble an efficient device with these SiNW. The presence of parasitic in the form of interfacial electrical resistance will have a significant impact on the performance of the TED. In this work, we explore the effect of the electrical contact resistance on the performance of a TED. Numerical simulations are performed on SiNW to investigate such effects on its cooling performance. Intrinsically, SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistance.

Keywords: Nanowire, Silicon, thermoelectric, electrical contact resistance, parasitics

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4 Fabrication and Characterization of Poly-Si Vertical Nanowire Thin Film Transistor

Authors: N. Shen, T. T. Le, H. Y. Yu, Z. X. Chen, K. T. Win, N. Singh, G. Q. Lo, D. -L. Kwong

Abstract:

In this paper, we present a vertical nanowire thin film transistor with gate-all-around architecture, fabricated using CMOS compatible processes. A novel method of fabricating polysilicon vertical nanowires of diameter as small as 30 nm using wet-etch is presented. Both n-type and p-type vertical poly-silicon nanowire transistors exhibit superior electrical characteristics as compared to planar devices. On a poly-crystalline nanowire of 30 nm diameter, high Ion/Ioff ratio of 106, low drain-induced barrier lowering (DIBL) of 50 mV/V, and low sub-threshold slope SS~100mV/dec are demonstrated for a device with channel length of 100 nm.

Keywords: thin-film transistor (TFT), Nanowire (NW), Gate-all-around (GAA), polysilicon (poly-Si)

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3 Vertical Silicon Nanowire MOSFET With A Fully-Silicided (FUSI) NiSi2 Gate

Authors: Z. X. Chen, N. Singh, D.-L. Kwong

Abstract:

This paper presents a vertical silicon nanowire n- MOSFET integrated with a CMOS-compatible fully-silicided (FUSI) NiSi2 gate. Devices with nanowire diameter of 50nm show good electrical performance (SS < 70mV/dec, DIBL < 30mV/V, Ion/Ioff > 107). Most significantly, threshold voltage tunability of about 0.2V is shown. Although threshold voltage remains low for the 50nm diameter device, it is expected to become more positive as nanowire diameter reduces.

Keywords: NiSi, fully-silicided (FUSI) gate, vertical siliconnanowire (SiNW), CMOS compatible

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2 Resistive RAM Based on Hfox and its Temperature Instability Study

Authors: Z. Fang, H.Y. Yu, W.J. Liu, N. Singh, G.Q. Lo

Abstract:

High performance Resistive Random Access Memory (RRAM) based on HfOx has been prepared and its temperature instability has been investigated in this work. With increasing temperature, it is found that: leakage current at high resistance state increases, which can be explained by the higher density of traps inside dielectrics (related to trap-assistant tunneling), leading to a smaller On/Off ratio; set and reset voltages decrease, which may be attributed to the higher oxygen ion mobility, in addition to the reduced potential barrier to create / recover oxygen ions (or oxygen vacancies); temperature impact on the RRAM retention degradation is more serious than electrical bias.

Keywords: resistive switching, RRAM, temperature instability

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1 Vertical GAA Silicon Nanowire Transistor with Impact of Temperature on Device Parameters

Authors: N. Shen, Z. X. Chen, K.D. Buddharaju, H. M. Chua, X. Li, N. Singh, G.Q Lo, D.-L. Kwong

Abstract:

In this paper, we present a vertical wire NMOS device fabricated using CMOS compatible processes. The impact of temperature on various device parameters is investigated in view of usual increase in surrounding temperature with device density.

Keywords: temperature dependence, Gate-all-around, silicon nanowire

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Abstracts

2 Optimization of Hot Metal Charging Circuit in a Steel Melting Shop Using Industrial Engineering Techniques for Achieving Manufacturing Excellence

Authors: N. Singh, A. Khullar, R. Shrivastava, I. Singh, A. S. Kumar

Abstract:

Steel forms the basis of any modern society and is essential to economic growth. India’s annual crude steel production has seen a consistent increase over the past years and is poised to grow to 300 million tons per annum by 2030-31 from current level of 110-120 million tons per annum. Steel industry is highly capital-intensive industry and to remain competitive, it is imperative that it invests in operational excellence. Due to inherent nature of the industry, there is large amount of variability in its supply chain both internally and externally. Production and productivity of a steel plant is greatly affected by the bottlenecks present in material flow logistics. The internal logistics constituting of transport of liquid metal within a steel melting shop (SMS) presents an opportunity in increasing the throughput with marginal capital investment. The study was carried out at one of the SMS of an integrated steel plant located in the eastern part of India. The plant has three SMS’s and the study was carried out at one of them. The objective of this study was to identify means to optimize SMS hot metal logistics through application of industrial engineering techniques. The study also covered the identification of non-value-added activities and proposed methods to eliminate the delays and improve the throughput of the SMS.

Keywords: Supply Chain, Optimization, Steel Making, workforce productivity, throughput enhancement

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1 Effects of Temperature and Mechanical Abrasion on Microplastics

Authors: N. Singh, G. K. Darbha

Abstract:

Since the last decade, a wave of research has begun to study the prevalence and impact of ever-increasing plastic pollution in the environment. The wide application and ubiquitous distribution of plastic have become a global concern due to its persistent nature. The disposal of plastics has emerged as one of the major challenges for waste management landfills. Microplastics (MPs) have found its existence in almost every environment, from the high altitude mountain lake to the deep sea sediments, polar icebergs, coral reefs, estuaries, beaches, and river, etc. Microplastics are fragments of plastics with size less than 5 mm. Microplastics can be classified as primary microplastics and secondary microplastics. Primary microplastics includes purposefully introduced microplastics into the end products for consumers (microbeads used in facial cleansers, personal care product, etc.), pellets (used in manufacturing industries) or fibres (from textile industries) which finally enters into the environment. Secondary microplastics are formed by disintegration of larger fragments under the exposure of sunlight, mechanical abrasive forces by rain, waves, wind and/or water. A number of factors affect the quantity of microplastic present in freshwater environments. In addition to physical forces, human population density proximal to the water body, proximity to urban centres, water residence time, and size of the water body also affects plastic properties. With time, other complex processes in nature such as physical, chemical and biological break down plastics by interfering with its structural integrity. Several studies demonstrate that microplastics found in wastewater sludge being used as manure for agricultural fields, thus having the tendency to alter the soil environment condition influencing the microbial population as well. Inadequate data are available on the fate and transport of microplastics under varying environmental conditions that are required to supplement important information for further research. In addition, microplastics have the tendency to absorb heavy metals and hydrophobic organic contaminants such as PAHs and PCBs from its surroundings and thus acting as carriers for these contaminants in the environment system. In this study, three kinds of microplastics (polyethylene, polypropylene and expanded polystyrene) of different densities were chosen. Plastic samples were placed in sand with different aqueous media (distilled water, surface water, groundwater and marine water). It was incubated at varying temperatures (25, 35 and 40 °C) and agitation levels (rpm). The results show that the number of plastic fragments enhanced with increase in temperature and agitation speed. Moreover, the rate of disintegration of expanded polystyrene is high compared to other plastics. These results demonstrate that temperature, salinity, and mechanical abrasion plays a major role in degradation of plastics. Since weathered microplastics are more harmful as compared to the virgin microplastics, long-term studies involving other environmental factors are needed to have a better understanding of degradation of plastics.

Keywords: temperature, Fragmentation, Environmental Contamination, Weathering, Microplastics

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