Dr. Aynur Aker

Committee: International Scientific Committee of Materials and Metallurgical Engineering
University: Siirt University
Department: Department of Computer and Technology Teaching
Research Fields: Materials Science

Publications

1 Microstructure, Mechanical, Electrical and Thermal Properties of the Al-Si-Ni Ternary Alloy

Authors: Aynur Aker, Hasan Kaya

Abstract:

In recent years, the use of the aluminum based alloys in the industry and technology are increasing. Alloying elements in aluminum have further been improving the strength and stiffness properties that provide superior compared to other metals. In this study, investigation of physical properties (microstructure, microhardness, tensile strength, electrical conductivity and thermal properties) in the Al-12.6wt.%Si-%2wt.Ni ternary alloy were investigated. Al-Si-Ni alloy was prepared in vacuum atmosphere. The samples were directionally solidified upwards with different growth rate V (8.3−165.45 μm/s) at constant temperature gradient G (7.73 K/mm). The flake spacings (λ), microhardness (HV), ultimate tensile strength (σ), electrical resistivity (ρ) and thermal properties (H, Cp, Tm) of the samples were measured. Influence of the growth rate and spacings on microhardness, ultimate tensile strength and electrical resistivity were investigated and relationships between them were obtained. According to results, λ values decrease with increasing V, but HV, σ and ρ values increase with increasing V. Variations of electrical resistivity (ρ) of solidified samples were also measured. The enthalpy of fusion (H) and specific heat (Cp) for the alloy was also determined by differential scanning calorimeter (DSC) from heating trace during the transformation from liquid to solid. The results in this work were compared with the previous similar experimental results.

Keywords: Enthalpy, Electrical Resistivity, Solidification, Microhardness, tensile stress

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Abstracts

4 Improving Digital Data Security Awareness among Teacher Candidates with Digital Storytelling Technique

Authors: Aynur Aker, Veysel ÇELİK, Ebru GÜÇ

Abstract:

Developments in information and communication technologies have increased both the speed of producing information and the speed of accessing new information. Accordingly, the daily lives of individuals have started to change. New concepts such as e-mail, e-government, e-school, e-signature have emerged. For this reason, prospective teachers who will be future teachers or school administrators are expected to have a high awareness of digital data security. The aim of this study is to reveal the effect of the digital storytelling technique on the data security awareness of pre-service teachers of computer and instructional technology education departments. For this purpose, participants were selected based on the principle of volunteering among third-grade students studying at the Computer and Instructional Technologies Department of the Faculty of Education at Siirt University. In the research, the pretest/posttest half experimental research model, one of the experimental research models, was used. In this framework, a 6-week lesson plan on digital data security awareness was prepared in accordance with the digital narration technique. Students in the experimental group formed groups of 3-6 people among themselves. The groups were asked to prepare short videos or animations for digital data security awareness. The completed videos were watched and evaluated together with prospective teachers during the evaluation process, which lasted approximately 2 hours. In the research, both quantitative and qualitative data collection tools were used by using the digital data security awareness scale and the semi-structured interview form consisting of open-ended questions developed by the researchers. According to the data obtained, it was seen that the digital storytelling technique was effective in creating data security awareness and creating permanent behavior changes for computer and instructional technology students.

Keywords: Self-efficacy, Self-regulation, Digital Storytelling, teacher candidates, digital data security

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3 Measurements of Physical Properties of Directionally Solidified Al-Si-Cu Ternary Alloy

Authors: Aynur Aker, Hasan Kaya

Abstract:

Al-12.6wt.%Si-2wt.%Cu ternary alloy of near eutectic composition was directionally solidified upward at a constant temperature gradient in a wide range of growth rates (V=8.25-165.41 µm/s). The microstructures (λ), microhardness (HV), tensile stress (σ) and electrical resistivity (ρ) were measured from directionally solidified samples. The dependence of microstructures, microhardness and electrical resistivity on growth rate (V) was also determined by statistical analysis. According to these results, it has been found that for increasing values of V, the values of HV, σ and ρ increase. Variations of electrical resistivity for casting Al-Si-Cu alloy were also measured at the temperature in range 300-500 K. The enthalpy (ΔH) and the specific heat (Cp) for the Al-Si-Cu alloy were determined by differential scanning calorimeter (DSC) from heating trace during the transformation from solid to liquid. The results obtained in this work were compared with the similar experimental results in the literature.

Keywords: Microstructures, Enthalpy, micro-hardness, Al-Si-Cu alloy, tensile stress electrical resistivity

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2 Microstructure, Mechanical, Electrical and Thermal Properties of the Al-Si-Ni Ternary Alloy

Authors: Aynur Aker, Hasan Kaya

Abstract:

In recent years, the use of the aluminum based alloys in the industry and technology are increasing. Alloying elements in aluminum have further been improving the strength and stiffness properties that provide superior compared to other metals. In this study, investigation of physical properties (microstructure, microhardness, tensile strength, electrical conductivity and thermal properties) in the Al-12.6wt.%Si-%2wt.Ni ternary alloy were investigated. Al-Si-Ni alloy was prepared in a graphite crucible under vacuum atmosphere. The samples were directionally solidified upwards with different growth rate (V) at constant temperature gradient G (7.73 K/mm). The microstructures (flake spacings, λ), microhardness (HV), ultimate tensile strength, electrical resistivity and thermal properties enthalpy of fusion and specific heat and melting temperature) of the samples were measured. Influence of the growth rate and flake spacings on microhardness, ultimate tensile strength and electrical resistivity were investigated and relationships between them were experimentally obtained by using regression analysis. According to results, λ values decrease with increasing V, but microhardness, ultimate tensile strength, electrical resistivity values increase with increasing V. Variations of electrical resistivity for cast samples with the temperature in the range of 300-1200 K were also measured by using a standard dc four-point probe technique. The enthalpy of fusion and specific heat for the same alloy was also determined by means of differential scanning calorimeter (DSC) from heating trace during the transformation from liquid to solid. The results obtained in this work were compared with the previous similar experimental results obtained for binary and ternary alloys.

Keywords: Enthalpy, Electrical Resistivity, Solidification, Microhardness, tensile stress

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1 Influence of the Growth Rate on Eutectic Microstructures and Physical Properties of Aluminum–Silicon-Cobalt Alloy

Authors: Aynur Aker, Hasan Kaya

Abstract:

Al-12.6wt.%Si-%2wt.Co alloy was prepared in a graphite crucible under vacuum atmosphere. The samples were directionally solidified upwards with different growth rate at constant temperature gradient using by Bridgman–type growth apparatus. The values of microstructures (λ) was measured from transverse sections of the samples. The microhardness (HV), ultimate tensile strength (σ) and electrical resistivity (ρ) of the directional solidification samples were also measured. Influence of the growth rate and spacings on microhardness, ultimate tensile strength and electrical resistivity were investigated and the relationships between them were experimentally obtained by using regression analysis. The results obtained in present work were compared with the previous similar experimental results obtained for binary and ternary alloys.

Keywords: Electrical Properties, Mechanical Properties, directional solidification, Al-Si-Co alloy

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