Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 3

measurements Related Publications

3 Monitorization of Junction Temperature Using a Thermal-Test-Device

Authors: B. Arzhanov, A. Correia, P. Delgado, J. Meireles

Abstract:

Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.

Keywords: Thermal Management, measurements, exposed pads, junction temperature, quad flat no-Lead packages

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2 Engine Power Effects on Support Interference

Authors: B.J.C. Horsten, L.L.M. Veldhuis

Abstract:

Renewed interest in propeller propulsion on aircraft configurations combined with higher propeller loads lead to the question how the effects of the propulsion on model support disturbances should be accounted for. In this paper, the determination of engine power effects on support interference of sting-mounted models is demonstrated by a measurement on a four-engine turboprop aircraft. CFD results on a more generic model are presented in order to clarify the possible mechanism behind engine power effects on support interference. The engine slipstream induces a local change in angle of sideslip at the model sting thereby influencing the sting near-field and far-field effects. Whether or not the net result of these changes in the disturbance pattern leads to a significant engine power effect depends on the configuration of the wind tunnel model and the test setup.

Keywords: CFD, measurements, engine power effects, support interference

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1 A Formal Suite of Object Relational Database Metrics

Authors: Justus S, K Iyakutti

Abstract:

Object Relational Databases (ORDB) are complex in nature than traditional relational databases because they combine the characteristics of both object oriented concepts and relational features of conventional databases. Design of an ORDB demands efficient and quality schema considering the structural, functional and componential traits. This internal quality of the schema is assured by metrics that measure the relevant attributes. This is extended to substantiate the understandability, usability and reliability of the schema, thus assuring external quality of the schema. This work institutes a formalization of ORDB metrics; metric definition, evaluation methodology and the calibration of the metric. Three ORDB schemas were used to conduct the evaluation and the formalization of the metrics. The metrics are calibrated using content and criteria related validity based on the measurability, consistency and reliability of the metrics. Nominal and summative scales are derived based on the evaluated metric values and are standardized. Future works pertaining to ORDB metrics forms the concluding note.

Keywords: measurements, Product metrics, Metrics calibration, Object-relational database

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