Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 3

electroplating Related Publications

3 Current Density Effect on Nickel Electroplating Using Post Supercritical CO2 Mixed Watts Electrolyte

Authors: Chun-Ying Lee, Mei-Wen Wu, Van Cuong Nguyen, Hung-Wei Chuang

Abstract:

In this study, a nickel film with nano-crystalline grains, high hardness and smooth surface was electrodeposited using a post supercritical carbon dioxide (CO2) mixed Watts electrolyte. Although the hardness was not as high as its Sc-CO2 counterpart, the thin coating contained significantly less number of nano-sized pinholes. By measuring the escape concentration of the dissolved CO2 in post Sc-CO2 mixed electrolyte with the elapsed time, it was believed that the residue of dissolved CO2 bubbles should closely relate to the improvement in hardness and surface roughness over its conventional plating counterpart. Therefore, shortening the duration of electroplating with the raise of current density up to 0.5 A/cm2 could effectively retain more post Sc-CO2 mixing effect. This study not only confirms the roles of dissolved CO2 bubbles in electrolyte but also provides a potential process to overcome most issues associated with the cost in building high-pressure chamber for large size products and continuous plating using supercritical method.

Keywords: Nickel, supercritical CO2, electroplating, Additive-free electrolyte

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2 Continuity Microplating using Image Processing

Authors: Ting-Chao Chen, Yean-Ren Hwang, Jing-Chie Lin

Abstract:

A real time image-guided electroplating system is proposed in this paper. Unlike previous electroplating systems, instead of using the intermittent mode to electroplate 500um long copper specimen, a CCD camera and a motion controller are used to adjust anode-cathode distance to obtain better results. Since the image of the gap distance is highly deteriorated due to complex chemical-electrical operation inside the electrolyte, to determine the gap distance, an image processing algorithm is developed and mainly based on the entropy and energy values. In addition, the color and incidence direction of light source are also discussed to help the image process in this paper. From the experiment results, the specimens created by the proposed system show better structure, better uniformity and better finishing surface compared to those by previous intermittent electroplating setup.

Keywords: electroplating, image guided, image process, light source

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1 Recovery of Copper and DCA from Simulated Micellar Enhanced Ultrafiltration (MEUF)Waste Stream

Authors: Chuan-Kun Liu, Chi-Wang Li

Abstract:

Simultaneous recovery of copper and DCA from simulated MEUF concentrated stream was investigated. Effects of surfactant (DCA) and metal (copper) concentrations, surfactant to metal molar ratio (S/M ratio), electroplating voltage, EDTA concentration, solution pH, and salt concentration on metal recovery and current efficiency were studied. Electric voltage of -0.5 V was shown to be optimum operation condition in terms of Cu recovery, current efficiency, and surfactant recovery. Increasing Cu recovery and current efficiency were observed with increases of Cu concentration while keeping concentration of DCA constant. However, increasing both Cu and DCA concentration while keeping S/M ratio constant at 2.5 showed detrimental effect on Cu recovery at DCA concentration higher than 15 mM. Cu recovery decreases with increasing pH while current efficiency showed an opposite trend. It is believed that conductivity is the main cause for discrepancy of Cu recovery and current efficiency observed at different pH. Finally, it was shown that EDTA had adverse effect on both Cu recovery and current efficiency while addition of NaCl salt had negative impact on current efficiency at concentration higher than 8000 mg/L.

Keywords: Metal Recovery, surfactant, electroplating, MEUF waste

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