Search results for: multicore chips
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 144

Search results for: multicore chips

84 An Examination of the Effects of Implantable Technologies on the Practices of Governmentality

Authors: Benn Van Den Ende

Abstract:

Over the last three decades, there has been an exponential increase in developments in implantable technologies such as the cardiac pacemaker, bionic prosthesis, and implantable chips. The effect of these technologies has been well researched in many areas. However, there is a lack of critical research in security studies. This paper will provide preliminary findings to an ongoing research project which aims to examine how implantable technologies effect the practices of governmentality in the context of security. It will do this by looking at the practices and techniques of governmentality along with different implantable technologies which increase, change or otherwise affect governmental practices. The preliminary research demonstrates that implantable technologies have a profound effect on the practices of governmentality, while also paving the way for further research into a potential ‘new’ form of governmentality in relation to these implantable technologies.

Keywords: critical security studies, governmentality, security theory, political theory, Foucault

Procedia PDF Downloads 155
83 Property of Diamond Coated Tools for Lapping Single-Crystal Sapphire Wafer

Authors: Feng Wei, Lu Wenzhuang, Cai Wenjun, Yu Yaping, Basnet Rabin, Zuo Dunwen

Abstract:

Diamond coatings were prepared on cemented carbide by hot filament chemical vapor deposition (HFCVD) method. Lapping experiment of single-crystal sapphire wafer was carried out using the prepared diamond coated tools. The diamond coatings and machined surface of the sapphire wafer were evaluated by SEM, laser confocal microscope and Raman spectrum. The results indicate that the lapping sapphire chips are small irregular debris and long thread-like debris. There is graphitization of diamond crystal during the lapping process. A low surface roughness can be obtained using a spherical grain diamond coated tool.

Keywords: lapping, nano-micro crystalline diamond coating, Raman spectrum, sapphire

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82 A Molding Surface Auto-inspection System

Authors: Ssu-Han Chen, Der-Baau Perng

Abstract:

Molding process in IC manufacturing secures chips against the harms done by hot, moisture or other external forces. While a chip was being molded, defects like cracks, dilapidation, or voids may be embedding on the molding surface. The molding surfaces the study poises to treat and the ones on the market, though, differ in the surface where texture similar to defects is everywhere. Manual inspection usually passes over low-contrast cracks or voids; hence an automatic optical inspection system for molding surface is necessary. The proposed system is consisted of a CCD, a coaxial light, a back light as well as a motion control unit. Based on the property of statistical textures of the molding surface, a series of digital image processing and classification procedure is carried out. After training of the parameter associated with above algorithm, result of the experiment suggests that the accuracy rate is up to 93.75%, contributing to the inspection quality of IC molding surface.

Keywords: molding surface, machine vision, statistical texture, discrete Fourier transformation

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81 FPGA Implementation of Adaptive Clock Recovery for TDMoIP Systems

Authors: Semih Demir, Anil Celebi

Abstract:

Circuit switched networks widely used until the end of the 20th century have been transformed into packages switched networks. Time Division Multiplexing over Internet Protocol (TDMoIP) is a system that enables Time Division Multiplexing (TDM) traffic to be carried over packet switched networks (PSN). In TDMoIP systems, devices that send TDM data to the PSN and receive it from the network must operate with the same clock frequency. In this study, it was aimed to implement clock synchronization process in Field Programmable Gate Array (FPGA) chips using time information attached to the packages received from PSN. The designed hardware is verified using the datasets obtained for the different carrier types and comparing the results with the software model. Field tests are also performed by using the real time TDMoIP system.

Keywords: clock recovery on TDMoIP, FPGA, MATLAB reference model, clock synchronization

Procedia PDF Downloads 238
80 Electrode Engineering for On-Chip Liquid Driving by Using Electrokinetic Effect

Authors: Reza Hadjiaghaie Vafaie, Aysan Madanpasandi, Behrooz Zare Desari, Seyedmohammad Mousavi

Abstract:

High lamination in microchannel is one of the main challenges in on-chip components like micro total analyzer systems and lab-on-a-chips. Electro-osmotic force is highly effective in chip-scale. This research proposes a microfluidic-based micropump for low ionic strength solutions. Narrow microchannels are designed to generate an efficient electroosmotic flow near the walls. Microelectrodes are embedded in the lateral sides and actuated by low electric potential to generate pumping effect inside the channel. Based on the simulation study, the fluid velocity increases by increasing the electric potential amplitude. We achieve a net flow velocity of 100 µm/s, by applying +/- 2 V to the electrode structures. Our proposed low voltage design is of interest in conventional lab-on-a-chip applications.

Keywords: integration, electrokinetic, on-chip, fluid pumping, microfluidic

Procedia PDF Downloads 261
79 Development of Forging Technology of Cam Ring Gear for Truck Using Small Bar

Authors: D. H. Park, Y. H. Tak, H. H. Kwon, G. J. Kwon, H. G. Kim

Abstract:

This study focused on developing forging technology of a large-diameter cam ring gear from the small bar. The analyses of temperature variation and deformation behavior of the material are important to obtain the optimal forging products. The hot compression test was carried out to know formability at high temperature. In order to define the optimum forging conditions including material temperature, strain and forging load, the finite element method was used to simulate the forging process of cam ring gear parts. Test results were in good agreement with the simulations. An existing cam ring gear is presented the chips generated by cutting the rod material and the durability issues, but this would be to develop a large-diameter cam ring gear forging parts for truck in order to solve the durability problem and the material waste.

Keywords: forging technology, cam ring, gear, truck, small bar

Procedia PDF Downloads 258
78 Genetic Algorithm Optimization of Microcantilever Based Resonator

Authors: Manjula Sutagundar, B. G. Sheeparamatti, D. S. Jangamshetti

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Micro Electro Mechanical Systems (MEMS) resonators have shown the potential of replacing quartz crystal technology for sensing and high frequency signal processing applications because of inherent advantages like small size, high quality factor, low cost, compatibility with integrated circuit chips. This paper presents the optimization and modelling and simulation of the optimized micro cantilever resonator. The objective of the work is to optimize the dimensions of a micro cantilever resonator for a specified range of resonant frequency and specific quality factor. Optimization is carried out using genetic algorithm. The genetic algorithm is implemented using MATLAB. The micro cantilever resonator is modelled in CoventorWare using the optimized dimensions obtained from genetic algorithm. The modeled cantilever is analysed for resonance frequency.

Keywords: MEMS resonator, genetic algorithm, modelling and simulation, optimization

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77 Influence of Plastic Waste Reinforcement on Compaction and Consolidation Behavior of Silty Soil

Authors: Maryam Meftahi, Yashar Hamidzadeh

Abstract:

In recent decades, the amount of solid waste production has been rising. In the meantime, plastic waste is one of the major parts of urban solid waste, so, recycling plastic waste from water bottles has become a serious challenge in the whole world. The experimental program includes the study of the effect of waste plastic fibers on maximum dry density (MDD), optimum moisture content (OMC) with different sizes and contents. Also, one dimensional consolidation tests were carried out to evaluate the benefit of utilizing randomly distributed waste plastics fiber to improve the engineering behavior of a tested soils. Silty soil specimens were prepared and tested at five different percentages of plastic waste content (i.e. 0.25%, 0.50%, 0.75%, 1% and 1.25% by weight of the parent soil). The size of plastic chips used, are 4 mm, 8 mm and 12 mm long and 4 mm in width. The results show that with the addition of waste plastic fibers, the MDD and OMC and also the compressibility of soil decrease significantly.

Keywords: silty soil, waste plastic, compaction, consolidation, reinforcement

Procedia PDF Downloads 137
76 Numerical Solution Speedup of the Laplace Equation Using FPGA Hardware

Authors: Abbas Ebrahimi, Mohammad Zandsalimy

Abstract:

The main purpose of this study is to investigate the feasibility of using FPGA (Field Programmable Gate Arrays) chips as alternatives for the conventional CPUs to accelerate the numerical solution of the Laplace equation. FPGA is an integrated circuit that contains an array of logic blocks, and its architecture can be reprogrammed and reconfigured after manufacturing. Complex circuits for various applications can be designed and implemented using FPGA hardware. The reconfigurable hardware used in this paper is an SoC (System on a Chip) FPGA type that integrates both microprocessor and FPGA architectures into a single device. In the present study the Laplace equation is implemented and solved numerically on both reconfigurable hardware and CPU. The precision of results and speedups of the calculations are compared together. The computational process on FPGA, is up to 20 times faster than a conventional CPU, with the same data precision. An analytical solution is used to validate the results.

Keywords: accelerating numerical solutions, CFD, FPGA, hardware definition language, numerical solutions, reconfigurable hardware

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75 Development of Ferrous-Aluminum Alloys from Recyclable Material by High Energy Milling

Authors: Arnold S. Freitas Neto, Rodrigo E. Coelho, Erick S. Mendonça

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This study aimed to obtain an alloy of Iron and Aluminum in the proportion of 50% of atomicity for each constituent. Alloys were obtained by processing recycled aluminum and chips of 1200 series carbon steel in a high-energy mill. For the experiment, raw materials were processed thorough high energy milling before mixing the substances. Subsequently, the mixture of 1200 series carbon steel and Aluminum powder was carried out a milling process. Thereafter, hot compression was performed in a closed die in order to obtain the samples. The pieces underwent heat treatments, sintering and aging. Lastly, the composition and the mechanical properties of their hardness were analyzed. In this paper, results are compared with previous studies, which used iron powder of high purity instead of Carbon steel in the composition.

Keywords: Fe-Al alloys, high energy milling, metallography characterization, powder metallurgy

Procedia PDF Downloads 274
74 Mechanical Study Printed Circuit Boards Bonding for Jefferson Laboratory Detector

Authors: F. Noto, F. De Persio, V. Bellini, G. Costa. F. Mammoliti, F. Meddi, C. Sutera, G. M. Urcioli

Abstract:

One plane X and one plane Y of silicon microstrip detectors will constitute the front part of the Super Bigbite Spectrometer that is under construction and that will be installed in the experimental Hall A of the Thomas Jefferson National Accelerator Facility (Jefferson Laboratory), located in Newport News, Virgina, USA. Each plane will be made up by two nearly identical, 300 μm thick, 10 cm x 10.3 cm wide silicon microstrip detectors with 50 um pitch, whose electronic signals will be transferred to the front-end electronic based on APV25 chips through C-shaped FR4 Printed Circuit Boards (PCB). A total of about 10000 strips are read-out. This paper treats the optimization of the detector support structure, the materials used through a finite element simulation. A very important aspect of the study will also cover the optimization of the bonding parameters between detector and electronics.

Keywords: FEM analysis, bonding, SBS tracker, mechanical structure

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73 Power Integrity Analysis of Power Delivery System in High Speed Digital FPGA Board

Authors: Anil Kumar Pandey

Abstract:

Power plane noise is the most significant source of signal integrity (SI) issues in a high-speed digital design. In this paper, power integrity (PI) analysis of multiple power planes in a power delivery system of a 12-layer high-speed FPGA board is presented. All 10 power planes of HSD board are analyzed separately by using 3D Electromagnetic based PI solver, then the transient simulation is performed on combined PI data of all planes along with voltage regulator modules (VRMs) and 70 current drawing chips to get the board level power noise coupling on different high-speed signals. De-coupling capacitors are placed between power planes and ground to reduce power noise coupling with signals.

Keywords: power integrity, power-aware signal integrity analysis, electromagnetic simulation, channel simulation

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72 Valorization of Residues from Forest Industry for the Generation of Energy

Authors: M. A. Amezcua-Allieri, E. Torres, J. A. Zermeño Eguía-Lis, M. Magdaleno, L. A. Melgarejo, E. Palmerín, A. Rosas, D. López, J. Aburto

Abstract:

The use of biomass to produce renewable energy is one of the forms that can be used to reduce the impact of energy production. Like any other energy resource, there are limitations for biomass use, and it must compete not only with fossil fuels but also with other renewable energy sources such as solar or wind energy. Combustion is currently the most efficient and widely used waste-to-energy process, in the areas where direct use of biomass is possible, without the need to make large transfers of raw material. Many industrial facilities can use agricultural or forestry waste, straw, chips, bagasse, etc. in their thermal systems without making major transformations or adjustments in the feeding to the ovens, making this waste an attractive and cost-effective option in terms of availability, access, and costs. In spite of the facilities and benefits, the environmental reasons (emission of gases and particulate material) are decisive for its use for energy purpose. This paper describes a valorization of residues from forest industry to generate energy, using a case study.

Keywords: bioenergy, forest waste, life-cycle assessment, waste-to-energy, electricity

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71 Valorization of Beer Brewing Wastes by Composting

Authors: M. E. Silva, I. Brás

Abstract:

The aim of this work was to study the viability of recycling the residual yeast and diatomaceous earth (RYDE) slurry generated by the beer brewing industry by composting with animal manures, as well as to evaluate the quality of the composts obtained. Two pilot composting trials were carried out with different mixes: cow manure/RYDE slurry (Pile CM) and sheep manure/RYDE slurry (Pile SM). For all piles, wood chips were applied as bulking agent. The process was monitored by evaluating standard physical and chemical parameters. The compost quality was assessed by the heavy metals content and phytotoxicity. Both piles reached a thermophilic phase in the first day, however having different trends. The pH showed a slight alkaline character. The C/N reached values lower than 19 at the end of composting process. Generally, all the piles exhibited absence of heavy metals. However, the pile SM exhibited phytotoxicity. This study showed that RYDE slurry can be valorized by composting with cow manure.

Keywords: beer brewing wastes, compost, valorization, quality

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70 Analyses and Optimization of Physical and Mechanical Properties of Direct Recycled Aluminium Alloy (AA6061) Wastes by ANOVA Approach

Authors: Mohammed H. Rady, Mohd Sukri Mustapa, S Shamsudin, M. A. Lajis, A. Wagiman

Abstract:

The present study is aimed at investigating microhardness and density of aluminium alloy chips when subjected to various settings of preheating temperature and preheating time. Three values of preheating temperature were taken as 450 °C, 500 °C, and 550 °C. On the other hand, three values of preheating time were chosen (1, 2, 3) hours. The influences of the process parameters (preheating temperature and time) were analyzed using Design of Experiments (DOE) approach whereby full factorial design with center point analysis was adopted. The total runs were 11 and they comprise of two factors of full factorial design with 3 center points. The responses were microhardness and density. The results showed that the density and microhardness increased with decreasing the preheating temperature. The results also found that the preheating temperature is more important to be controlled rather than the preheating time in microhardness analysis while both the preheating temperature and preheating time are important in density analysis. It can be concluded that setting temperature at 450 °C for 1 hour resulted in the optimum responses.

Keywords: AA6061, density, DOE, hot extrusion, microhardness

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69 Analyze of Nanoscale Materials and Devices for Future Communication and Telecom Networks in the Gas Refinery

Authors: Mohamad Bagher Heidari, Hefzollah Mohammadian

Abstract:

New discoveries in materials on the nanometer-length scale are expected to play an important role in addressing ongoing and future challenges in the field of communication. Devices and systems for ultra-high speed short and long range communication links, portable and power efficient computing devices, high-density memory and logics, ultra-fast interconnects, and autonomous and robust energy scavenging devices for accessing ambient intelligence and needed information will critically depend on the success of next-generation emerging nonmaterials and devices. This article presents some exciting recent developments in nonmaterials that have the potential to play a critical role in the development and transformation of future intelligent communication and telecom networks in the gas refinery. The industry is benefiting from nanotechnology advances with numerous applications including those in smarter sensors, logic elements, computer chips, memory storage devices, optoelectronics.

Keywords: nonmaterial, intelligent communication, nanoscale, nanophotonic, telecom

Procedia PDF Downloads 289
68 Physical Verification Flow on Multiple Foundries

Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Muhammad Al Baqir Zinal Abidin, Md Hanif Md Nasir

Abstract:

This paper will discuss how we optimize our physical verification flow in our IC Design Department having various rule decks from multiple foundries. Our ultimate goal is to achieve faster time to tape-out and avoid schedule delay. Currently the physical verification runtimes and memory usage have drastically increased with the increasing number of design rules, design complexity and the size of the chips to be verified. To manage design violations, we use a number of solutions to reduce the amount of violations needed to be checked by physical verification engineers. The most important functions in physical verifications are DRC (design rule check), LVS (layout vs. schematic) and XRC (extraction). Since we have a multiple number of foundries for our design tape-outs, we need a flow that improve the overall turnaround time and ease of use of the physical verification process. The demand for fast turnaround time is even more critical since the physical design is the last stage before sending the layout to the foundries.

Keywords: physical verification, DRC, LVS, XRC, flow, foundry, runset

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67 RFID Laptop Monitoring and Management System

Authors: Francis E. Idachaba, Sarah Uyimeh Tommy

Abstract:

This paper describes the design of an RFID laptop monitoring and management system. Laptops embedded with RFID chips are monitored and tracked to provide a monitoring system for the purpose of tracking as well as monitoring movement of the laptops in and out of a building. The proposed system is implemented with both hardware and software components. The hardware architecture consists of RFID passive tag, RFID module (reader), and a server hosting the application and database. The RFID readers are distributed at major exits of a building or premises. The tags are programmed with owner laptop details are concealed in the laptops. The software architecture consists of application software that has the APIs (Applications Programming Interface) necessary to interface the RFID system with the PC, to achieve automated laptop monitoring system. A friendly graphic user interface (GUI) and a database that saves all readings and owners details. The system is capable of reducing laptop theft especially in students’ hostels as laptops can be monitored as they are taken either in or out of the building.

Keywords: asset tracking, GUI, laptop monitoring, radio frequency identification, passive tags

Procedia PDF Downloads 357
66 150 KVA Multifunction Laboratory Test Unit Based on Power-Frequency Converter

Authors: Bartosz Kedra, Robert Malkowski

Abstract:

This paper provides description and presentation of laboratory test unit built basing on 150 kVA power frequency converter and Simulink RealTime platform. Assumptions, based on criteria which load and generator types may be simulated using discussed device, are presented, as well as control algorithm structure. As laboratory setup contains transformer with thyristor controlled tap changer, a wider scope of setup capabilities is presented. Information about used communication interface, data maintenance, and storage solution as well as used Simulink real-time features is presented. List and description of all measurements are provided. Potential of laboratory setup modifications is evaluated. For purposes of Rapid Control Prototyping, a dedicated environment was used Simulink RealTime. Therefore, load model Functional Unit Controller is based on a PC computer with I/O cards and Simulink RealTime software. Simulink RealTime was used to create real-time applications directly from Simulink models. In the next step, applications were loaded on a target computer connected to physical devices that provided opportunity to perform Hardware in the Loop (HIL) tests, as well as the mentioned Rapid Control Prototyping process. With Simulink RealTime, Simulink models were extended with I/O cards driver blocks that made automatic generation of real-time applications and performing interactive or automated runs on a dedicated target computer equipped with a real-time kernel, multicore CPU, and I/O cards possible. Results of performed laboratory tests are presented. Different load configurations are described and experimental results are presented. This includes simulation of under frequency load shedding, frequency and voltage dependent characteristics of groups of load units, time characteristics of group of different load units in a chosen area and arbitrary active and reactive power regulation basing on defined schedule.

Keywords: MATLAB, power converter, Simulink Real-Time, thyristor-controlled tap changer

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65 An Intelligent Thermal-Aware Task Scheduler in Multiprocessor System on a Chip

Authors: Sina Saadati

Abstract:

Multiprocessors Systems-On-Chips (MPSOCs) are used widely on modern computers to execute sophisticated software and applications. These systems include different processors for distinct aims. Most of the proposed task schedulers attempt to improve energy consumption. In some schedulers, the processor's temperature is considered to increase the system's reliability and performance. In this research, we have proposed a new method for thermal-aware task scheduling which is based on an artificial neural network (ANN). This method enables us to consider a variety of factors in the scheduling process. Some factors like ambient temperature, season (which is important for some embedded systems), speed of the processor, computing type of tasks and have a complex relationship with the final temperature of the system. This Issue can be solved using a machine learning algorithm. Another point is that our solution makes the system intelligent So that It can be adaptive. We have also shown that the computational complexity of the proposed method is cheap. As a consequence, It is also suitable for battery-powered systems.

Keywords: task scheduling, MOSOC, artificial neural network, machine learning, architecture of computers, artificial intelligence

Procedia PDF Downloads 67
64 The Investigation of the Impact of Process and Location Parameters in Warpage Study of Semiconductor Packages

Authors: Wheyming Song, Ssu-Ping Lin

Abstract:

The primary advantage of package-on-package (PoP) packaging is that since it has less volume, it weighs less. But this is also related to its principal drawback, which is warpage. This research investigates how PoP package warpage patterns are affected by assembling process parameters, including substrate temperature, injection speed, injection temperature, and compound forces. We also investigate how warpage patterns are affected by the location of the silicon chip. The methodologies used in this research are design of experiment and warpage simulation via ANSYS. We propose a regression model to predict the warpage value as a function of substrate temperature, injection speed, injection temperature, and compound forces. Our results show that interaction effects exist between substrate temperature and compound forces and between injection speed and injection temperature. Therefore, determining the optimal values for substrate temperature, compound forces, injection speed, and injection temperature cannot be done individually. Also, our results show that the warpage patterns based on the location of silicon chips can be classified into 11 groups, with the largest warpage occurring at the left-most and right-most sides.

Keywords: package-on-package, warpage, design of experiment, simulation

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63 Interaction of Glycolipid S-TGA-1 with Bacteriorhodopsin and Its Functional Role

Authors: Masataka Inada, Masanao Kinoshita, Nobuaki Matsumori

Abstract:

It has been demonstrated that lipid molecules in biological membranes are responsible for the functionalization and structuration of membrane proteins. However, it is still unclear how the interaction of lipid molecules with membrane proteins is correlated with the function of the membrane proteins. Here we first developed an evaluation method for the interaction between membrane proteins and lipid molecules via surface plasmon resonance (SPR) analysis. Bacteriorhodopsin (bR), which was obtained by the culture of halobacteria, was used as a membrane protein. We prepared SPR sensor chips covered with self-assembled monolayer containing mercaptocarboxylic acids, and immobilized bR onto them. Then, we evaluated the interactions with various lipids that have different structures. As a result, the halobacterium-specific glycolipid S-TGA-1 was found to have much higher affinity with bRs than other lipids. This is probably due to not only hydrophobic and electrostatic interactions but also hydrogen bonds with sugar moieties in the glycolipid. Next, we analyzed the roles of the lipid in the structuration and functionalization of bR. CD analysis showed that S-TGA-1 could promote trimerization of bR monomers more efficiently than any other lipids. Flash photolysis further indicated that bR trimers formed by S-TGA-1 reproduced the photocyclic activity of bR in purple membrane, halobacterium-membrane. These results suggest that S-TGA-1 promotes trimerization of bR through strong interactions and consequently fulfills the bR’s function efficiently.

Keywords: membrane protein, lipid, interaction, bacteriorhodopsin, glycolipid

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62 Functional Neural Network for Decision Processing: A Racing Network of Programmable Neurons Where the Operating Model Is the Network Itself

Authors: Frederic Jumelle, Kelvin So, Didan Deng

Abstract:

In this paper, we are introducing a model of artificial general intelligence (AGI), the functional neural network (FNN), for modeling human decision-making processes. The FNN is composed of multiple artificial mirror neurons (AMN) racing in the network. Each AMN has a similar structure programmed independently by the users and composed of an intention wheel, a motor core, and a sensory core racing at a specific velocity. The mathematics of the node’s formulation and the racing mechanism of multiple nodes in the network will be discussed, and the group decision process with fuzzy logic and the transformation of these conceptual methods into practical methods of simulation and in operations will be developed. Eventually, we will describe some possible future research directions in the fields of finance, education, and medicine, including the opportunity to design an intelligent learning agent with application in AGI. We believe that FNN has a promising potential to transform the way we can compute decision-making and lead to a new generation of AI chips for seamless human-machine interactions (HMI).

Keywords: neural computing, human machine interation, artificial general intelligence, decision processing

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61 Spectroscopic Study of Eu³⁺ Ions Doped Potassium Lead Alumino Borate Glasses for Photonic Device Application

Authors: Nisha Deopa, Allam Srinivasa Rao

Abstract:

Quaternary potassium lead alumino borate (KPbAlB) glasses doped with different concentration of Eu³⁺ ions have been synthesized by melt quench technique and characterized by X-ray diffraction (XRD), Scanning electron microscope (SEM), Photoluminescence (PL), Time-resolved photoluminescence (TRPL) and CIE-chromaticity co-ordinates to study their luminescence behavior. A broad hump was observed in XRD spectrum confirms glassy nature of as-prepared glasses. By using Judd-Ofelt (J-O) theory, various radiative parameters for the prominent fluorescent levels of Eu³⁺ have been investigated. The intense emission peak was observed at 613 nm (⁵D₀→⁷F₂) under 393 nm excitation, matches well with the excitation of n-UV LED chips. The decay profiles observed for ⁵D₀ level were exponential for lower Eu³⁺ ion concentration while non-exponential for higher concentration, which may be due to efficient energy transfer between Eu³⁺-Eu³⁺ through cross relaxation and subsequent quenching observed. From the emission cross-sections, branching ratios, quantum efficiency and CIE coordinates, it was concluded that 7 mol % of Eu³⁺ ion concentration (glass B) is optimum in KPbAlB glasses for photonic device application.

Keywords: energy transfer, glasses, J-O parameters, photoluminescence

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60 A Spatial Point Pattern Analysis to Recognize Fail Bit Patterns in Semiconductor Manufacturing

Authors: Youngji Yoo, Seung Hwan Park, Daewoong An, Sung-Shick Kim, Jun-Geol Baek

Abstract:

The yield management system is very important to produce high-quality semiconductor chips in the semiconductor manufacturing process. In order to improve quality of semiconductors, various tests are conducted in the post fabrication (FAB) process. During the test process, large amount of data are collected and the data includes a lot of information about defect. In general, the defect on the wafer is the main causes of yield loss. Therefore, analyzing the defect data is necessary to improve performance of yield prediction. The wafer bin map (WBM) is one of the data collected in the test process and includes defect information such as the fail bit patterns. The fail bit has characteristics of spatial point patterns. Therefore, this paper proposes the feature extraction method using the spatial point pattern analysis. Actual data obtained from the semiconductor process is used for experiments and the experimental result shows that the proposed method is more accurately recognize the fail bit patterns.

Keywords: semiconductor, wafer bin map, feature extraction, spatial point patterns, contour map

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59 Radio Frequency Identification Chips in Colour Preference Tracking

Authors: A. Ballard

Abstract:

The ability to track goods and products en route in the delivery system, in the warehouse, and on the top floor is a huge advantage to shippers and retailers. Recently the emergence of radio frequency identification (RFID) technology has enabled this better than ever before. However, a significant problem exists in that RFID technology depends on the quality of the information stored for each tagged product. Because of the profusion of names for colours, it is very difficult to ascertain that stored values are recognised by all users who view the product visually. This paper reports the findings of a study in which 50 consumers and 50 logistics workers were shown colour swatches and asked to choose the name of the colour from a multiple choice list. They were then asked to match consumer products, including toasters, jumpers, and toothbrushes, with the identifying inventory information available for each one. The findings show that the ability to match colours was significantly stronger with the color swatches than with the consumer products and that while logistics professionals made more frequent correct identification than the consumers, their results were still unsatisfactorily low. Based on these findings, a proposed universal model of colour identification numbers has been developed.

Keywords: consumer preferences, supply chain logistics, radio frequency identification, RFID, colour preference

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58 A Study on the Annual Doses Received by the Workers of Some Medical Practices

Authors: Eltayeb Hamad Elneel Yousif

Abstract:

This paper describes occupational radiation doses of workers in non-destructive testing (NDT) and some medical practices during the year 2007. The annual doses received by the workers of a public hospital are presented in this report. The Department is facilitated with HARSHAW Reader model 6600 and assigned the rule of personal monitoring to contribute in controlling and reducing the doses received by radiation workers. TLD cards with two TLD chips type LiF: Mg, Ti (TLD-100) were calibrated to measure the personal dose equivalent Hp(10). Around 150 medical radiation workers were monitored throughout the year. Each worker received a single TLD card worn on the chest above lead apron and returned for laboratory reading every two months. The average annual doses received by the workers of radiotherapy, nuclear medicine and diagnostic radiology were evaluated. The annual doses for individual radiation workers ranged between 0.55-4.42 mSv, 0.48-1.86 mSv, and 0.48-0.91 mSv for the workers of radiotherapy, nuclear medicine and diagnostic radiology, respectively. The mean dose per worker was 1.29±1, 1.03±0.4, and 0.69±0.2 mSv, respectively. The results showed compliance with international dose limits. Our results reconfirm the importance of personal dosimetry service in assuring the radiation protection of medical staff in developing countries.

Keywords: radiation medicine, non-destructive testing, TLD, public hospital

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57 Modification of Polyurethane Adhesive for OSB/EPS Panel Production

Authors: Stepan Hysek, Premysl Sedivka, Petra Gajdacova

Abstract:

Currently, structural composite materials contain cellulose-based particles (wood chips, fibers) bonded with synthetic adhesives containing formaldehyde (urea-formaldehyde, melamine-formaldehyde adhesives and others). Formaldehyde is classified as a volatile substance with provable carcinogenic effects on live organisms, and an emphasis has been put on continual reduction of its content in products. One potential solution could be the development of an agglomerated material which does not contain adhesives releasing formaldehyde. A potential alternative to formaldehyde-based adhesives could be polyurethane adhesives containing no formaldehyde. Such adhesives have been increasingly used in applications where a few years ago formaldehyde-based adhesives were the only option. Advantages of polyurethane adhesive in comparison with others in the industry include the high elasticity of the joint, which is able to resist dynamic stress, and resistance to increased humidity and climatic effects. These properties predict polyurethane adhesives to be used in OSB/EPS panel production. The objective of this paper is to develop an adhesive for bonding of sandwich panels made of material based on wood and other materials, e.g. SIP) and optimization of input components in order to obtain an adhesive with required properties suitable for bonding of the given materials without involvement of formaldehyde. It was found that polyurethane recyclate as a filler is suitable modification of polyurethane adhesive and results have clearly revealed that modified adhesive can be used for OSB/EPS panel production.

Keywords: adhesive, polyurethane, recyclate, SIP

Procedia PDF Downloads 224
56 Interplay of Power Management at Core and Server Level

Authors: Jörg Lenhardt, Wolfram Schiffmann, Jörg Keller

Abstract:

While the feature sizes of recent Complementary Metal Oxid Semiconductor (CMOS) devices decrease the influence of static power prevails their energy consumption. Thus, power savings that benefit from Dynamic Frequency and Voltage Scaling (DVFS) are diminishing and temporal shutdown of cores or other microchip components become more worthwhile. A consequence of powering off unused parts of a chip is that the relative difference between idle and fully loaded power consumption is increased. That means, future chips and whole server systems gain more power saving potential through power-aware load balancing, whereas in former times this power saving approach had only limited effect, and thus, was not widely adopted. While powering off complete servers was used to save energy, it will be superfluous in many cases when cores can be powered down. An important advantage that comes with that is a largely reduced time to respond to increased computational demand. We include the above developments in a server power model and quantify the advantage. Our conclusion is that strategies from datacenters when to power off server systems might be used in the future on core level, while load balancing mechanisms previously used at core level might be used in the future at server level.

Keywords: power efficiency, static power consumption, dynamic power consumption, CMOS

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55 PDMS-Free Microfluidic Chips Fabrication and Utilisation for Pulsed Electric Fields Applications

Authors: Arunas Stirke, Neringa Bakute, Gatis Mozolevskis

Abstract:

A technology of microfluidics is an emerging tool in the field of biology, medicine and chemistry. Microfluidic device is also known as ‘lab-on-a-chip’ technology [1]. In moving from macro- to microscale, there is unprecedented control over spatial and temporal gradients and patterns that cannot be captured in conventional Petri dishes and well plates [2]. However, there is not a single standard microfluidic chip designated for all purposes – every different field of studies needs a specific microchip with certain geometries, inlet/outlet, channel depth and other parameters to precisely regulate the required function. Since our group is studying an effect of pulsed electric field (PEF) to the cells, we have manufactured a microfluidic chip designated for high-throughput electroporation of cells. In our microchip, a cell culture chamber is divided into two parallel channels by a membrane, meanwhile electrodes for electroporation are attached to the wall of the channels. Both microchannels have their own inlet and outlet, enabling injection of transfection material separately. Our perspective is to perform electroporation of mammalian cells in two different ways: (1) plasmid and cells are injected in the same microchannel and (2) injected into separate microchannels. Moreover, oxygen and pH sensors are integrated on order to analyse cell viability parameters after PEF treatment.

Keywords: microfluidics, chip, fabrication, electroporation

Procedia PDF Downloads 48