Search results for: chips
Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 134

Search results for: chips

74 Development of Ferrous-Aluminum Alloys from Recyclable Material by High Energy Milling

Authors: Arnold S. Freitas Neto, Rodrigo E. Coelho, Erick S. Mendonça

Abstract:

This study aimed to obtain an alloy of Iron and Aluminum in the proportion of 50% of atomicity for each constituent. Alloys were obtained by processing recycled aluminum and chips of 1200 series carbon steel in a high-energy mill. For the experiment, raw materials were processed thorough high energy milling before mixing the substances. Subsequently, the mixture of 1200 series carbon steel and Aluminum powder was carried out a milling process. Thereafter, hot compression was performed in a closed die in order to obtain the samples. The pieces underwent heat treatments, sintering and aging. Lastly, the composition and the mechanical properties of their hardness were analyzed. In this paper, results are compared with previous studies, which used iron powder of high purity instead of Carbon steel in the composition.

Keywords: Fe-Al alloys, high energy milling, metallography characterization, powder metallurgy

Procedia PDF Downloads 274
73 Mechanical Study Printed Circuit Boards Bonding for Jefferson Laboratory Detector

Authors: F. Noto, F. De Persio, V. Bellini, G. Costa. F. Mammoliti, F. Meddi, C. Sutera, G. M. Urcioli

Abstract:

One plane X and one plane Y of silicon microstrip detectors will constitute the front part of the Super Bigbite Spectrometer that is under construction and that will be installed in the experimental Hall A of the Thomas Jefferson National Accelerator Facility (Jefferson Laboratory), located in Newport News, Virgina, USA. Each plane will be made up by two nearly identical, 300 μm thick, 10 cm x 10.3 cm wide silicon microstrip detectors with 50 um pitch, whose electronic signals will be transferred to the front-end electronic based on APV25 chips through C-shaped FR4 Printed Circuit Boards (PCB). A total of about 10000 strips are read-out. This paper treats the optimization of the detector support structure, the materials used through a finite element simulation. A very important aspect of the study will also cover the optimization of the bonding parameters between detector and electronics.

Keywords: FEM analysis, bonding, SBS tracker, mechanical structure

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72 Power Integrity Analysis of Power Delivery System in High Speed Digital FPGA Board

Authors: Anil Kumar Pandey

Abstract:

Power plane noise is the most significant source of signal integrity (SI) issues in a high-speed digital design. In this paper, power integrity (PI) analysis of multiple power planes in a power delivery system of a 12-layer high-speed FPGA board is presented. All 10 power planes of HSD board are analyzed separately by using 3D Electromagnetic based PI solver, then the transient simulation is performed on combined PI data of all planes along with voltage regulator modules (VRMs) and 70 current drawing chips to get the board level power noise coupling on different high-speed signals. De-coupling capacitors are placed between power planes and ground to reduce power noise coupling with signals.

Keywords: power integrity, power-aware signal integrity analysis, electromagnetic simulation, channel simulation

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71 Valorization of Residues from Forest Industry for the Generation of Energy

Authors: M. A. Amezcua-Allieri, E. Torres, J. A. Zermeño Eguía-Lis, M. Magdaleno, L. A. Melgarejo, E. Palmerín, A. Rosas, D. López, J. Aburto

Abstract:

The use of biomass to produce renewable energy is one of the forms that can be used to reduce the impact of energy production. Like any other energy resource, there are limitations for biomass use, and it must compete not only with fossil fuels but also with other renewable energy sources such as solar or wind energy. Combustion is currently the most efficient and widely used waste-to-energy process, in the areas where direct use of biomass is possible, without the need to make large transfers of raw material. Many industrial facilities can use agricultural or forestry waste, straw, chips, bagasse, etc. in their thermal systems without making major transformations or adjustments in the feeding to the ovens, making this waste an attractive and cost-effective option in terms of availability, access, and costs. In spite of the facilities and benefits, the environmental reasons (emission of gases and particulate material) are decisive for its use for energy purpose. This paper describes a valorization of residues from forest industry to generate energy, using a case study.

Keywords: bioenergy, forest waste, life-cycle assessment, waste-to-energy, electricity

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70 Valorization of Beer Brewing Wastes by Composting

Authors: M. E. Silva, I. Brás

Abstract:

The aim of this work was to study the viability of recycling the residual yeast and diatomaceous earth (RYDE) slurry generated by the beer brewing industry by composting with animal manures, as well as to evaluate the quality of the composts obtained. Two pilot composting trials were carried out with different mixes: cow manure/RYDE slurry (Pile CM) and sheep manure/RYDE slurry (Pile SM). For all piles, wood chips were applied as bulking agent. The process was monitored by evaluating standard physical and chemical parameters. The compost quality was assessed by the heavy metals content and phytotoxicity. Both piles reached a thermophilic phase in the first day, however having different trends. The pH showed a slight alkaline character. The C/N reached values lower than 19 at the end of composting process. Generally, all the piles exhibited absence of heavy metals. However, the pile SM exhibited phytotoxicity. This study showed that RYDE slurry can be valorized by composting with cow manure.

Keywords: beer brewing wastes, compost, valorization, quality

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69 Analyses and Optimization of Physical and Mechanical Properties of Direct Recycled Aluminium Alloy (AA6061) Wastes by ANOVA Approach

Authors: Mohammed H. Rady, Mohd Sukri Mustapa, S Shamsudin, M. A. Lajis, A. Wagiman

Abstract:

The present study is aimed at investigating microhardness and density of aluminium alloy chips when subjected to various settings of preheating temperature and preheating time. Three values of preheating temperature were taken as 450 °C, 500 °C, and 550 °C. On the other hand, three values of preheating time were chosen (1, 2, 3) hours. The influences of the process parameters (preheating temperature and time) were analyzed using Design of Experiments (DOE) approach whereby full factorial design with center point analysis was adopted. The total runs were 11 and they comprise of two factors of full factorial design with 3 center points. The responses were microhardness and density. The results showed that the density and microhardness increased with decreasing the preheating temperature. The results also found that the preheating temperature is more important to be controlled rather than the preheating time in microhardness analysis while both the preheating temperature and preheating time are important in density analysis. It can be concluded that setting temperature at 450 °C for 1 hour resulted in the optimum responses.

Keywords: AA6061, density, DOE, hot extrusion, microhardness

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68 Analyze of Nanoscale Materials and Devices for Future Communication and Telecom Networks in the Gas Refinery

Authors: Mohamad Bagher Heidari, Hefzollah Mohammadian

Abstract:

New discoveries in materials on the nanometer-length scale are expected to play an important role in addressing ongoing and future challenges in the field of communication. Devices and systems for ultra-high speed short and long range communication links, portable and power efficient computing devices, high-density memory and logics, ultra-fast interconnects, and autonomous and robust energy scavenging devices for accessing ambient intelligence and needed information will critically depend on the success of next-generation emerging nonmaterials and devices. This article presents some exciting recent developments in nonmaterials that have the potential to play a critical role in the development and transformation of future intelligent communication and telecom networks in the gas refinery. The industry is benefiting from nanotechnology advances with numerous applications including those in smarter sensors, logic elements, computer chips, memory storage devices, optoelectronics.

Keywords: nonmaterial, intelligent communication, nanoscale, nanophotonic, telecom

Procedia PDF Downloads 289
67 Physical Verification Flow on Multiple Foundries

Authors: Rohaya Abdul Wahab, Raja Mohd Fuad Tengku Aziz, Nazaliza Othman, Sharifah Saleh, Nabihah Razali, Muhammad Al Baqir Zinal Abidin, Md Hanif Md Nasir

Abstract:

This paper will discuss how we optimize our physical verification flow in our IC Design Department having various rule decks from multiple foundries. Our ultimate goal is to achieve faster time to tape-out and avoid schedule delay. Currently the physical verification runtimes and memory usage have drastically increased with the increasing number of design rules, design complexity and the size of the chips to be verified. To manage design violations, we use a number of solutions to reduce the amount of violations needed to be checked by physical verification engineers. The most important functions in physical verifications are DRC (design rule check), LVS (layout vs. schematic) and XRC (extraction). Since we have a multiple number of foundries for our design tape-outs, we need a flow that improve the overall turnaround time and ease of use of the physical verification process. The demand for fast turnaround time is even more critical since the physical design is the last stage before sending the layout to the foundries.

Keywords: physical verification, DRC, LVS, XRC, flow, foundry, runset

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66 RFID Laptop Monitoring and Management System

Authors: Francis E. Idachaba, Sarah Uyimeh Tommy

Abstract:

This paper describes the design of an RFID laptop monitoring and management system. Laptops embedded with RFID chips are monitored and tracked to provide a monitoring system for the purpose of tracking as well as monitoring movement of the laptops in and out of a building. The proposed system is implemented with both hardware and software components. The hardware architecture consists of RFID passive tag, RFID module (reader), and a server hosting the application and database. The RFID readers are distributed at major exits of a building or premises. The tags are programmed with owner laptop details are concealed in the laptops. The software architecture consists of application software that has the APIs (Applications Programming Interface) necessary to interface the RFID system with the PC, to achieve automated laptop monitoring system. A friendly graphic user interface (GUI) and a database that saves all readings and owners details. The system is capable of reducing laptop theft especially in students’ hostels as laptops can be monitored as they are taken either in or out of the building.

Keywords: asset tracking, GUI, laptop monitoring, radio frequency identification, passive tags

Procedia PDF Downloads 357
65 An Intelligent Thermal-Aware Task Scheduler in Multiprocessor System on a Chip

Authors: Sina Saadati

Abstract:

Multiprocessors Systems-On-Chips (MPSOCs) are used widely on modern computers to execute sophisticated software and applications. These systems include different processors for distinct aims. Most of the proposed task schedulers attempt to improve energy consumption. In some schedulers, the processor's temperature is considered to increase the system's reliability and performance. In this research, we have proposed a new method for thermal-aware task scheduling which is based on an artificial neural network (ANN). This method enables us to consider a variety of factors in the scheduling process. Some factors like ambient temperature, season (which is important for some embedded systems), speed of the processor, computing type of tasks and have a complex relationship with the final temperature of the system. This Issue can be solved using a machine learning algorithm. Another point is that our solution makes the system intelligent So that It can be adaptive. We have also shown that the computational complexity of the proposed method is cheap. As a consequence, It is also suitable for battery-powered systems.

Keywords: task scheduling, MOSOC, artificial neural network, machine learning, architecture of computers, artificial intelligence

Procedia PDF Downloads 67
64 The Investigation of the Impact of Process and Location Parameters in Warpage Study of Semiconductor Packages

Authors: Wheyming Song, Ssu-Ping Lin

Abstract:

The primary advantage of package-on-package (PoP) packaging is that since it has less volume, it weighs less. But this is also related to its principal drawback, which is warpage. This research investigates how PoP package warpage patterns are affected by assembling process parameters, including substrate temperature, injection speed, injection temperature, and compound forces. We also investigate how warpage patterns are affected by the location of the silicon chip. The methodologies used in this research are design of experiment and warpage simulation via ANSYS. We propose a regression model to predict the warpage value as a function of substrate temperature, injection speed, injection temperature, and compound forces. Our results show that interaction effects exist between substrate temperature and compound forces and between injection speed and injection temperature. Therefore, determining the optimal values for substrate temperature, compound forces, injection speed, and injection temperature cannot be done individually. Also, our results show that the warpage patterns based on the location of silicon chips can be classified into 11 groups, with the largest warpage occurring at the left-most and right-most sides.

Keywords: package-on-package, warpage, design of experiment, simulation

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63 Interaction of Glycolipid S-TGA-1 with Bacteriorhodopsin and Its Functional Role

Authors: Masataka Inada, Masanao Kinoshita, Nobuaki Matsumori

Abstract:

It has been demonstrated that lipid molecules in biological membranes are responsible for the functionalization and structuration of membrane proteins. However, it is still unclear how the interaction of lipid molecules with membrane proteins is correlated with the function of the membrane proteins. Here we first developed an evaluation method for the interaction between membrane proteins and lipid molecules via surface plasmon resonance (SPR) analysis. Bacteriorhodopsin (bR), which was obtained by the culture of halobacteria, was used as a membrane protein. We prepared SPR sensor chips covered with self-assembled monolayer containing mercaptocarboxylic acids, and immobilized bR onto them. Then, we evaluated the interactions with various lipids that have different structures. As a result, the halobacterium-specific glycolipid S-TGA-1 was found to have much higher affinity with bRs than other lipids. This is probably due to not only hydrophobic and electrostatic interactions but also hydrogen bonds with sugar moieties in the glycolipid. Next, we analyzed the roles of the lipid in the structuration and functionalization of bR. CD analysis showed that S-TGA-1 could promote trimerization of bR monomers more efficiently than any other lipids. Flash photolysis further indicated that bR trimers formed by S-TGA-1 reproduced the photocyclic activity of bR in purple membrane, halobacterium-membrane. These results suggest that S-TGA-1 promotes trimerization of bR through strong interactions and consequently fulfills the bR’s function efficiently.

Keywords: membrane protein, lipid, interaction, bacteriorhodopsin, glycolipid

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62 Functional Neural Network for Decision Processing: A Racing Network of Programmable Neurons Where the Operating Model Is the Network Itself

Authors: Frederic Jumelle, Kelvin So, Didan Deng

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In this paper, we are introducing a model of artificial general intelligence (AGI), the functional neural network (FNN), for modeling human decision-making processes. The FNN is composed of multiple artificial mirror neurons (AMN) racing in the network. Each AMN has a similar structure programmed independently by the users and composed of an intention wheel, a motor core, and a sensory core racing at a specific velocity. The mathematics of the node’s formulation and the racing mechanism of multiple nodes in the network will be discussed, and the group decision process with fuzzy logic and the transformation of these conceptual methods into practical methods of simulation and in operations will be developed. Eventually, we will describe some possible future research directions in the fields of finance, education, and medicine, including the opportunity to design an intelligent learning agent with application in AGI. We believe that FNN has a promising potential to transform the way we can compute decision-making and lead to a new generation of AI chips for seamless human-machine interactions (HMI).

Keywords: neural computing, human machine interation, artificial general intelligence, decision processing

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61 Spectroscopic Study of Eu³⁺ Ions Doped Potassium Lead Alumino Borate Glasses for Photonic Device Application

Authors: Nisha Deopa, Allam Srinivasa Rao

Abstract:

Quaternary potassium lead alumino borate (KPbAlB) glasses doped with different concentration of Eu³⁺ ions have been synthesized by melt quench technique and characterized by X-ray diffraction (XRD), Scanning electron microscope (SEM), Photoluminescence (PL), Time-resolved photoluminescence (TRPL) and CIE-chromaticity co-ordinates to study their luminescence behavior. A broad hump was observed in XRD spectrum confirms glassy nature of as-prepared glasses. By using Judd-Ofelt (J-O) theory, various radiative parameters for the prominent fluorescent levels of Eu³⁺ have been investigated. The intense emission peak was observed at 613 nm (⁵D₀→⁷F₂) under 393 nm excitation, matches well with the excitation of n-UV LED chips. The decay profiles observed for ⁵D₀ level were exponential for lower Eu³⁺ ion concentration while non-exponential for higher concentration, which may be due to efficient energy transfer between Eu³⁺-Eu³⁺ through cross relaxation and subsequent quenching observed. From the emission cross-sections, branching ratios, quantum efficiency and CIE coordinates, it was concluded that 7 mol % of Eu³⁺ ion concentration (glass B) is optimum in KPbAlB glasses for photonic device application.

Keywords: energy transfer, glasses, J-O parameters, photoluminescence

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60 A Spatial Point Pattern Analysis to Recognize Fail Bit Patterns in Semiconductor Manufacturing

Authors: Youngji Yoo, Seung Hwan Park, Daewoong An, Sung-Shick Kim, Jun-Geol Baek

Abstract:

The yield management system is very important to produce high-quality semiconductor chips in the semiconductor manufacturing process. In order to improve quality of semiconductors, various tests are conducted in the post fabrication (FAB) process. During the test process, large amount of data are collected and the data includes a lot of information about defect. In general, the defect on the wafer is the main causes of yield loss. Therefore, analyzing the defect data is necessary to improve performance of yield prediction. The wafer bin map (WBM) is one of the data collected in the test process and includes defect information such as the fail bit patterns. The fail bit has characteristics of spatial point patterns. Therefore, this paper proposes the feature extraction method using the spatial point pattern analysis. Actual data obtained from the semiconductor process is used for experiments and the experimental result shows that the proposed method is more accurately recognize the fail bit patterns.

Keywords: semiconductor, wafer bin map, feature extraction, spatial point patterns, contour map

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59 Radio Frequency Identification Chips in Colour Preference Tracking

Authors: A. Ballard

Abstract:

The ability to track goods and products en route in the delivery system, in the warehouse, and on the top floor is a huge advantage to shippers and retailers. Recently the emergence of radio frequency identification (RFID) technology has enabled this better than ever before. However, a significant problem exists in that RFID technology depends on the quality of the information stored for each tagged product. Because of the profusion of names for colours, it is very difficult to ascertain that stored values are recognised by all users who view the product visually. This paper reports the findings of a study in which 50 consumers and 50 logistics workers were shown colour swatches and asked to choose the name of the colour from a multiple choice list. They were then asked to match consumer products, including toasters, jumpers, and toothbrushes, with the identifying inventory information available for each one. The findings show that the ability to match colours was significantly stronger with the color swatches than with the consumer products and that while logistics professionals made more frequent correct identification than the consumers, their results were still unsatisfactorily low. Based on these findings, a proposed universal model of colour identification numbers has been developed.

Keywords: consumer preferences, supply chain logistics, radio frequency identification, RFID, colour preference

Procedia PDF Downloads 91
58 A Study on the Annual Doses Received by the Workers of Some Medical Practices

Authors: Eltayeb Hamad Elneel Yousif

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This paper describes occupational radiation doses of workers in non-destructive testing (NDT) and some medical practices during the year 2007. The annual doses received by the workers of a public hospital are presented in this report. The Department is facilitated with HARSHAW Reader model 6600 and assigned the rule of personal monitoring to contribute in controlling and reducing the doses received by radiation workers. TLD cards with two TLD chips type LiF: Mg, Ti (TLD-100) were calibrated to measure the personal dose equivalent Hp(10). Around 150 medical radiation workers were monitored throughout the year. Each worker received a single TLD card worn on the chest above lead apron and returned for laboratory reading every two months. The average annual doses received by the workers of radiotherapy, nuclear medicine and diagnostic radiology were evaluated. The annual doses for individual radiation workers ranged between 0.55-4.42 mSv, 0.48-1.86 mSv, and 0.48-0.91 mSv for the workers of radiotherapy, nuclear medicine and diagnostic radiology, respectively. The mean dose per worker was 1.29±1, 1.03±0.4, and 0.69±0.2 mSv, respectively. The results showed compliance with international dose limits. Our results reconfirm the importance of personal dosimetry service in assuring the radiation protection of medical staff in developing countries.

Keywords: radiation medicine, non-destructive testing, TLD, public hospital

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57 Modification of Polyurethane Adhesive for OSB/EPS Panel Production

Authors: Stepan Hysek, Premysl Sedivka, Petra Gajdacova

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Currently, structural composite materials contain cellulose-based particles (wood chips, fibers) bonded with synthetic adhesives containing formaldehyde (urea-formaldehyde, melamine-formaldehyde adhesives and others). Formaldehyde is classified as a volatile substance with provable carcinogenic effects on live organisms, and an emphasis has been put on continual reduction of its content in products. One potential solution could be the development of an agglomerated material which does not contain adhesives releasing formaldehyde. A potential alternative to formaldehyde-based adhesives could be polyurethane adhesives containing no formaldehyde. Such adhesives have been increasingly used in applications where a few years ago formaldehyde-based adhesives were the only option. Advantages of polyurethane adhesive in comparison with others in the industry include the high elasticity of the joint, which is able to resist dynamic stress, and resistance to increased humidity and climatic effects. These properties predict polyurethane adhesives to be used in OSB/EPS panel production. The objective of this paper is to develop an adhesive for bonding of sandwich panels made of material based on wood and other materials, e.g. SIP) and optimization of input components in order to obtain an adhesive with required properties suitable for bonding of the given materials without involvement of formaldehyde. It was found that polyurethane recyclate as a filler is suitable modification of polyurethane adhesive and results have clearly revealed that modified adhesive can be used for OSB/EPS panel production.

Keywords: adhesive, polyurethane, recyclate, SIP

Procedia PDF Downloads 224
56 Interplay of Power Management at Core and Server Level

Authors: Jörg Lenhardt, Wolfram Schiffmann, Jörg Keller

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While the feature sizes of recent Complementary Metal Oxid Semiconductor (CMOS) devices decrease the influence of static power prevails their energy consumption. Thus, power savings that benefit from Dynamic Frequency and Voltage Scaling (DVFS) are diminishing and temporal shutdown of cores or other microchip components become more worthwhile. A consequence of powering off unused parts of a chip is that the relative difference between idle and fully loaded power consumption is increased. That means, future chips and whole server systems gain more power saving potential through power-aware load balancing, whereas in former times this power saving approach had only limited effect, and thus, was not widely adopted. While powering off complete servers was used to save energy, it will be superfluous in many cases when cores can be powered down. An important advantage that comes with that is a largely reduced time to respond to increased computational demand. We include the above developments in a server power model and quantify the advantage. Our conclusion is that strategies from datacenters when to power off server systems might be used in the future on core level, while load balancing mechanisms previously used at core level might be used in the future at server level.

Keywords: power efficiency, static power consumption, dynamic power consumption, CMOS

Procedia PDF Downloads 191
55 PDMS-Free Microfluidic Chips Fabrication and Utilisation for Pulsed Electric Fields Applications

Authors: Arunas Stirke, Neringa Bakute, Gatis Mozolevskis

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A technology of microfluidics is an emerging tool in the field of biology, medicine and chemistry. Microfluidic device is also known as ‘lab-on-a-chip’ technology [1]. In moving from macro- to microscale, there is unprecedented control over spatial and temporal gradients and patterns that cannot be captured in conventional Petri dishes and well plates [2]. However, there is not a single standard microfluidic chip designated for all purposes – every different field of studies needs a specific microchip with certain geometries, inlet/outlet, channel depth and other parameters to precisely regulate the required function. Since our group is studying an effect of pulsed electric field (PEF) to the cells, we have manufactured a microfluidic chip designated for high-throughput electroporation of cells. In our microchip, a cell culture chamber is divided into two parallel channels by a membrane, meanwhile electrodes for electroporation are attached to the wall of the channels. Both microchannels have their own inlet and outlet, enabling injection of transfection material separately. Our perspective is to perform electroporation of mammalian cells in two different ways: (1) plasmid and cells are injected in the same microchannel and (2) injected into separate microchannels. Moreover, oxygen and pH sensors are integrated on order to analyse cell viability parameters after PEF treatment.

Keywords: microfluidics, chip, fabrication, electroporation

Procedia PDF Downloads 48
54 Chipless RFID Capacity Enhancement Using the E-pulse Technique

Authors: Haythem H. Abdullah, Hesham Elkady

Abstract:

With the fast increase in radio frequency identification (RFID) applications such as medical recording, library management, etc., the limitation of active tags stems from its need to external batteries as well as passive or active chips. The chipless RFID tag reduces the cost to a large extent but at the expense of utilizing the spectrum. The reduction of the cost of chipless RFID is due to the absence of the chip itself. The identification is done by utilizing the spectrum in such a way that the frequency response of the tags consists of some resonance frequencies that represent the bits. The system capacity is decided by the number of resonators within the pre-specified band. It is important to find a solution to enhance the spectrum utilization when using chipless RFID. Target identification is a process that results in a decision that a specific target is present or not. Several target identification schemes are present, but one of the most successful techniques in radar target identification in the oscillatory region is the extinction pulse technique (E-Pulse). The E-Pulse technique is used to identify targets via its characteristics (natural) modes. By introducing an innovative solution for chipless RFID reader and tag designs, the spectrum utilization goes to the optimum case. In this paper, a novel capacity enhancement scheme based on the E-pulse technique is introduced to improve the performance of the chipless RFID system.

Keywords: chipless RFID, E-pulse, natural modes, resonators

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53 Enhanced Test Scheme based on Programmable Write Time for Future Computer Memories

Authors: Nor Zaidi Haron, Fauziyah Salehuddin, Norsuhaidah Arshad, Sani Irwan Salim

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Resistive random access memories (RRAMs) are one of the main candidates for future computer memories. However, due to their tiny size and immature device technology, the quality of the outgoing RRAM chips is seen as a serious issue. Defective RRAM cells might behave differently than existing semiconductor memories (Dynamic RAM, Static RAM, and Flash), meaning that they are difficult to be detected using existing test schemes. This paper presents an enhanced test scheme, referred to as Programmable Short Write Time (PSWT) that is able to improve the detection of faulty RRAM cells. It is developed by applying multiple weak write operations, each with different time durations. The test circuit embedded in the RRAM chip is made programmable in order to supply different weak write times during testing. The RRAM electrical model is described using Verilog-AMS language and is simulated using HSPICE simulation tools. Simulation results show that the proposed test scheme offers better open-resistive fault detection compared to existing test schemes.

Keywords: memory fault, memory test, design-for-testability, resistive random access memory

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52 Horizontal-Vertical and Enhanced-Unicast Interconnect Testing Techniques for Network-on-Chip

Authors: Mahdiar Hosseinghadiry, Razali Ismail, F. Fotovati

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One of the most important and challenging tasks in testing network-on-chip based system-on-chips (NoC based SoCs) is to verify the communication entity. It is important because of its usage for transferring both data packets and test patterns for intellectual properties (IPs) during normal and test mode. Hence, ensuring of NoC reliability is required for reliable IPs functionality and testing. On the other hand, it is challenging due to the required time to test it and the way of transferring test patterns from the tester to the NoC components. In this paper, two testing techniques for mesh-based NoC interconnections are proposed. The first one is based on one-by-one testing and the second one divides NoC interconnects into three parts, horizontal links of switches in even columns, horizontal links of switches in odd columns and all vertical. A design for testability (DFT) architecture is represented to send test patterns directly to each switch under test and also support the proposed testing techniques by providing a loopback path in each switch. The simulation results shows the second proposed testing mechanism outperforms in terms of test time because this method test all the interconnects in only three phases, independent to the number of existed interconnects in the network, while test time of other methods are highly dependent to the number of switches and interconnects in the NoC.

Keywords: on chip, interconnection testing, horizontal-vertical testing, enhanced unicast

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51 An Investigation on Fresh and Hardened Properties of Concrete While Using Polyethylene Terephthalate (PET) as Aggregate

Authors: Md. Jahidul Islam, A. K. M. Rakinul Islam, M. Salamah Meherier

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This study investigates the suitability of using plastic, such as polyethylene terephthalate (PET), as a partial replacement of natural coarse and fine aggregates (for example, brick chips and natural sand) to produce lightweight concrete for load bearing structural members. The plastic coarse aggregate (PCA) and plastic fine aggregate (PFA) were produced from melted polyethylene terephthalate (PET) bottles. Tests were conducted using three different water–cement (w/c) ratios, such as 0.42, 0.48, and 0.57, where PCA and PFA were used as 50% replacement of coarse and fine aggregate respectively. Fresh and hardened properties of concrete have been compared for natural aggregate concrete (NAC), PCA concrete (PCC) and PFA concrete (PFC). The compressive strength of concrete at 28 days varied with the water–cement ratio for both the PCC and PFC. Between PCC and PFC, PFA concrete showed the highest compressive strength (23.7 MPa) at 0.42 w/c ratio and also the lowest compressive strength (13.7 MPa) at 0.57 w/c ratio. Significant reduction in concrete density was mostly observed for PCC samples, ranging between 1977–1924 kg/m³. With the increase in water–cement ratio PCC achieved higher workability compare to both NAC and PFC. It was found that both the PCA and PFA contained concrete achieved the required compressive strength to be used for structural purpose as partial replacement of the natural aggregate; but to obtain the desired lower density as lightweight concrete the PCA is most suited.

Keywords: polyethylene terephthalate, plastic aggregate, concrete, fresh and hardened properties

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50 Information Needs of Cassava Processors on Small-Scale Cassava Processing in Oyo State, Nigeria

Authors: Rafiat Bolanle Fasasi-Hammed

Abstract:

Cassava is an important food crop in rural households of Nigeria. It has a high potential for product diversification, because it can be processed into various products forms for human consumption and can be made into chips for farm animals, and also starch and starch derivatives. However, cassava roots are highly perishable and contain potentially toxic cyanogenic glycosides which necessitate its processing. Therefore, this study was carried out to assess information needs of cassava processors on food safety practices in Oyo State, Nigeria. Simple random sampling technique was used in the selection of 110 respondents for this study. Descriptive statistics and chi-square were used to analyze the data collected. Results of this study showed that the mean age of the respondents was 39.4 years, majority (78.7%) of the respondents was married, 51.9% had secondary education; 45.8% of the respondents have spent more than 12 years in cassava processing. The mean income realized was ₦26,347.50/month from cassava processing. Information on cassava processing got to the respondents through friends, family and relations (73.6%) and fellow cassava processors (58.6%). Serious constraints identified were ineffective extension agents (93.9%), food safety regulatory agencies (88.1%) and inadequate processing and storage facilities (67.8%). Chi-square results showed that significant relationship existed between socio-economic characteristics of the respondents (χ2 = 29.80, df = 2,), knowledge level (χ2 = 9.26, df = 4), constraints (χ2 = 13.11, df = 2) and information needs at p < 0.05 level of significance. The study recommends that there should be regular training on improved cassava processing methods for the cassava processors in the study area.

Keywords: information, needs, cassava, Oyo State, processing

Procedia PDF Downloads 265
49 Co-Composting of Poultry Manure with Different Organic Amendments

Authors: M. E. Silva, I. Brás

Abstract:

To study the influence of different organic amendments on the quality of poultry manure compost, three pilot composting trials were carried out with different mixes: poultry manure/carcasse meal/ashes/grape pomace (Pile 1), poultry manure/ cellulosic sludge (Pile 2) and poultry manure (Pile 3). For all piles, wood chips were applied as bulking agent. The process was monitored, over time, by evaluating standard physical and chemical parameters, such as, pH, electric conductivity, moisture, organic matter and ash content, total carbon and total nitrogen content, carbon/nitrogen ratio (C/N) and content in mineral elements. Piles 1 and 2 reached a thermophilic phase, however having different trends. Pile 1 reached this phase earlier than Pile 2. For both, the pH showed a slight alkaline character and the electric conductivity was lower than 2 mS/cm. Also, the initial C/N value was 22 and reached values lower than 15 at the end of composting process. The total N content of the Pile 1 increased slightly during composting, in contrast with the others piles. At the end of composting process, the phosphorus content ranged between 54 and 236 mg/kg dry matter, for Pile 2 and 3, respectively. Generally, the Piles 1 and 3 exhibited similar heavy metals content. This study showed that organic amendments can be used as carbon source, given that the final composts presented parameters within the range of those recommended in the 2nd Draft of EU regulation proposal (DG Env.A.2 2001) for compost quality.

Keywords: co-composting, compost quality, organic ammendment, poultry manure

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48 Application of Carbon Nanotube and Nanowire FET Devices in Future VLSI

Authors: Saurabh Chaudhury, Sanjeet Kumar Sinha

Abstract:

The MOSFET has been the main building block in high performance and low power VLSI chips for the last several decades. Device scaling is fundamental to technological advancements, which allows more devices to be integrated on a single die providing greater functionality per chip. Ultimately, the goal of scaling is to build an individual transistor that is smaller, faster, cheaper, and consumes less power. Scaling continued following Moore's law initially and now we see an exponential growth in today's nano scaled chip. However, device scaling to deep nano meter regime leads to exponential increase in leakage currents and excessive heat generation. Moreover, fabrication process variability causing a limitation to further scaling. Researchers believe that with a mix of chemistry, physics, and engineering, nano electronics may provide a solution to increasing fabrication costs and may allow integrated circuits to be scaled beyond the limits of the modern transistor. Carbon nano tube (CNT) and nano wires (NW) based FETs have been analyzed and characterized in laboratory and also been demonstrated as prototypes. This work presents an extensive simulation based study and analysis of CNTFET and NW-FET devices and comparison of the results with conventional MOSFET. From this study, we can conclude that these devices have got some excellent properties and favorable characteristics which will definitely lead the future semiconductor devices in post silicon era.

Keywords: carbon nanotube, nanowire FET, low power, nanoscaled devices, VLSI

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47 A Finite Element Based Predictive Stone Lofting Simulation Methodology for Automotive Vehicles

Authors: Gaurav Bisht, Rahul Rathnakumar, Ravikumar Duggirala

Abstract:

Predictive simulations are one of the key focus areas in safety-critical industries such as aerospace and high-performance automotive engineering. The stone-chipping study is one such effort taken up by the industry to predict and evaluate the damage caused due to gravel impact on vehicles. This paper describes a finite elements based method that can simulate the ejection of gravel chips from a vehicle tire. The FE simulations were used to obtain the initial ejection velocity of the stones for various driving conditions using a computational contact mechanics approach. To verify the accuracy of the tire model, several parametric studies were conducted. The FE simulations resulted in stone loft velocities ranging from 0–8 m/s, regardless of tire speed. The stress on the tire at the instant of initial contact with the stone increased linearly with vehicle speed. Mesh convergence studies indicated that a highly resolved tire mesh tends to result in better momentum transfer between the tire and the stone. A fine tire mesh also showed a linearly increasing relationship between the tire forward speed and stone lofting speed, which was not observed in coarser meshes. However, it also highlighted a potential challenge, in that the ejection velocity vector of the stone seemed to be sensitive to the mesh, owing to the FE-based contact mechanical formulation of the problem.

Keywords: abaqus, contact mechanics, foreign object debris, stone chipping

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46 Development and Characterization of a Composite Material for Ceiling Board Construction Applications in Ethiopia

Authors: Minase Yitbarek Mengistu, Abrham Melkamu, Dawit Yisfaw, Bisrat Belihu, Abdulhakim Lalega

Abstract:

This research was aimed at reducing and recycling waste paper and sawdust from our environment, thereby reducing environmental pollution resulting from the management/disposal of these waste materials. In this research, some mechanical properties of composite ceiling board materials made from waste paper, sawdust, and pineapple leaf fibers were investigated to determine their suitability for use in low-cost construction work. The ceiling board was obtained from the waste of paper, sawdust chips, and pineapple leaf fibers by manual mechanical bonding techniques using dissolved polystyrene films as a binding agent. The results obtained showed that the water absorption values of between 6 % and 8.1 %; as well as density values of 500 kg/mm3 and 611.1 kg/mm3.From our result, the better one is a ratio of pineapple leaf fiber 25%, sawdust 40%, binder 25%, and waste paper 10%. The composite ceiling boards were successfully nailed with firm grips. These values obtained were compared with those of the conventional ceiling boards and it was observed that these composite materials can be used for internal low-cost construction work and Insulation (acoustic and thermal) performance. It is highly recommended that small and medium enterprises be encouraged to venture into waste recycling and the production of these composite ceiling materials to create jobs for skilled and unskilled labor that are locally available.

Keywords: composite material, environment, textile, ceiling board

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45 Microstructure and Tribological Properties of AlSi5Cu2/SiC Composite

Authors: Magdalena Suśniak, Joanna Karwan-Baczewska

Abstract:

Microstructure and tribological properties of AlSi5Cu2 matrix composite reinforced with SiC have been studied by microscopic examination and basic tribological properties. Composite material was produced by the mechanical alloying and spark plasma sintering (SPS) technique. The mixture of AlSi5Cu2 chips with 0, 10, 15 wt. % of SiC powder were placed in 250 ml mixing jar and milled 40 hours. To prevent the extreme cold welding the 1 wt. % of stearic acid was added to the powder mixture as a process control agent. Mechanical alloying provide to obtain composites powder with uniform distribution of SiC in matrix. Composite powders were poured into a graphite and a pulsed electric current was passed through powder under vacuum to consolidate material. Processing conditions were: sintering temperature 450°C, uniaxial pressure 32MPa, time of sintering 5 minutes. After SPS process composite samples indicate higher hardness values, lower weight loss, and lower coefficient of friction as compared with the unreinforced alloy. Light microscope micrograph of the worn surfaces and wear debris revealed that in the unreinforced alloy the prominent wear mechanism was the adhesive wear. In the AlSi5Cu2/SiC composites, by increasing of SiC the wear mechanism changed from adhesive and micro-cutting to abrasive and delamination for composite with 20 SiC wt. %. In all the AlSi5Cu2/SiC composites, abrasive wear was the main wear mechanism.

Keywords: aluminum matrix composite, mechanical alloying, spark plasma sintering, AlSi5Cu2/SiC composite

Procedia PDF Downloads 353