Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 4

printed circuit board Related Abstracts

4 Treatment and Reuse of Nonmetallic PCBs Waste

Authors: Shantha Kumari Muniyandi, Johan Sohaili, Siti Suhaila Mohamad

Abstract:

The strength development, durability and leachability aspects of mortar added with nonmetallic printed circuit board (NMPCBs) were investigated. This study aims to propose methods for treatment and reuse of NMPCBs waste. The leachability of raw NMPCBs was tested for toxicity by performing the Crushed Block Leachability (CBL) test. The effectiveness of the treatment was evaluated by performing compressive, flexural strength, durability and whole block leachability (WBL) tests on the mortar. The results indicated that the concentration of metals leach from the raw NMPCBs are within the standard limits and higher than the concentration of metals from WBL test. The compressive and flexural strength of the NMPCBs mortar was generally lower than the standard mortar. From durability tests, weight and compressive strength both of mortars was decrease after soaking in acid solution. As a conclusion, the treated NMPCBs can be reused in profitable and environmentally friendly ways and has broad application prospects.

Keywords: treatment, reuse, nonmetallic, printed circuit board

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3 The Performance of Typical Kinds of Coating of Printed Circuit Board under Accelerated Degradation Test

Authors: Xiaohui Wang, Liwei Sun, Guilin Zhang

Abstract:

Printed circuit board (PCB) is the carrier of electronic components. Its coating is the first barrier for protecting itself. If the coating is damaged, the performance of printed circuit board will decrease rapidly until failure. Therefore, the coating plays an important role in the entire printed circuit board. There are common four kinds of coating of printed circuit board that the material of the coatings are paryleneC, acrylic, polyurethane, silicone. In this paper, we designed an accelerated degradation test of humid and heat for these four kinds of coating. And chose insulation resistance, moisture absorption and surface morphology as its test indexes. By comparing the change of insulation resistance of the coating before and after the test, we estimate failure time of these coatings based on the degradation of insulation resistance. Based on the above, we estimate the service life of the four kinds of PCB.

Keywords: Life Assessment, printed circuit board, insulation resistance, coating material

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2 A Study on the Reliability Evaluation of a Timer Card for Air Dryer of the Railway Vehicle

Authors: Chul Su Kim, Jun Ku Lee, Won Jun Lee

Abstract:

The EMU (electric multiple unit) vehicle timer card is a PCB (printed circuit board) for controlling the air-dryer to remove the moisture of the generated air from the air compressor of the braking device. This card is exposed to the lower part of the railway vehicle, so it is greatly affected by the external environment such as temperature and humidity. The main cause of the failure of this timer card is deterioration of soldering area of the PCB surface due to temperature and humidity. Therefore, in the viewpoint of preventive maintenance, it is important to evaluate the reliability of the timer card and predict the replacement cycle to secure the safety of the air braking device is one of the main devices for driving. In this study, the existing and the improved products were evaluated on the reliability through ALT (accelerated life test). In addition, the acceleration factor by the 'Coffin-Manson' equation was obtained, and the remaining lifetime was compared and examined.

Keywords: printed circuit board, reliability evaluation, timer card, Accelerated Life Test

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1 Characterization of Thin Woven Composites Used in Printed Circuit Boards by Combining Numerical and Experimental Approaches

Authors: Sébastien Mercier, Gautier Girard, Marion Martiny, Mohamad Jrad, Mohamed-Slim Bahi, Laurent Bodin, Francois Lechleiter, David Nevo, Sophie Dareys

Abstract:

Reliability of electronic devices has always been of highest interest for Aero-MIL and space applications. In any electronic device, Printed Circuit Board (PCB), providing interconnection between components, is a key for reliability. During the last decades, PCB technologies evolved to sustain and/or fulfill increased original equipment manufacturers requirements and specifications, higher densities and better performances, faster time to market and longer lifetime, newer material and mixed buildups. From the very beginning of the PCB industry up to recently, qualification, experiments and trials, and errors were the most popular methods to assess system (PCB) reliability. Nowadays OEM, PCB manufacturers and scientists are working together in a close relationship in order to develop predictive models for PCB reliability and lifetime. To achieve that goal, it is fundamental to characterize precisely base materials (laminates, electrolytic copper, …), in order to understand failure mechanisms and simulate PCB aging under environmental constraints by means of finite element method for example. The laminates are woven composites and have thus an orthotropic behaviour. The in-plane properties can be measured by combining classical uniaxial testing and digital image correlation. Nevertheless, the out-of-plane properties cannot be evaluated due to the thickness of the laminate (a few hundred of microns). It has to be noted that the knowledge of the out-of-plane properties is fundamental to investigate the lifetime of high density printed circuit boards. A homogenization method combining analytical and numerical approaches has been developed in order to obtain the complete elastic orthotropic behaviour of a woven composite from its precise 3D internal structure and its experimentally measured in-plane elastic properties. Since the mechanical properties of the resin surrounding the fibres are unknown, an inverse method is proposed to estimate it. The methodology has been applied to one laminate used in hyperfrequency spatial applications in order to get its elastic orthotropic behaviour at different temperatures in the range [-55°C; +125°C]. Next; numerical simulations of a plated through hole in a double sided PCB are performed. Results show the major importance of the out-of-plane properties and the temperature dependency of these properties on the lifetime of a printed circuit board. Acknowledgements—The support of the French ANR agency through the Labcom program ANR-14-LAB7-0003-01, support of CNES, Thales Alenia Space and Cimulec is acknowledged.

Keywords: Homogenization, printed circuit board, orthotropic behaviour, woven composites

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