Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 5

Data center Related Abstracts

5 Fuzzy Expert Systems Applied to Intelligent Design of Data Centers

Authors: Mario M. Figueroa de la Cruz, Claudia I. Solorzano, Raul Acosta, Ignacio Funes


This technological development project seeks to create a tool that allows companies, in need of implementing a Data Center, intelligently determining factors for allocating resources support cooling and power supply (UPS) in its conception. The results should show clearly the speed, robustness and reliability of a system designed for deployment in environments where they must manage and protect large volumes of data.

Keywords: Telecommunications, Expert Systems, Fuzzy Logic, Data center

Procedia PDF Downloads 147
4 Computer Server Virtualization

Authors: Pradeep M. C. Chand


Virtual infrastructure initiatives often spring from data center server consolidation projects, which focus on reducing existing infrastructure “box count”, retiring older hardware or life-extending legacy applications. Server consolidation benefits result from a reduction in the overall number of systems and related recurring costs (power, cooling, rack space, etc.) and also helps in the reduction of heat to the environment.

Keywords: Project, Data center, consolidation, server virtualization

Procedia PDF Downloads 371
3 A New Paradigm to Make Cloud Computing Greener

Authors: Apurva Saxena, Sunita Gond


Demand of computation, data storage in large amount are rapidly increases day by day. Cloud computing technology fulfill the demand of today’s computation but this will lead to high power consumption in cloud data centers. Initiative for Green IT try to reduce power consumption and its adverse environmental impacts. Paper also focus on various green computing techniques, proposed models and efficient way to make cloud greener.

Keywords: Cloud Computing, Green Computing, Virtualization, Data center

Procedia PDF Downloads 376
2 4-Channel CWDM Optical Transceiver Applying Silicon Photonics Ge-Photodiode and MZ-Modulator

Authors: Do-Won Kim, Andy Eu Jin Lim, Raja Muthusamy Kumarasamy, Vishal Vinayak, Jacky Wang Yu-Shun, Jason Liow Tsung Yang, Patrick Lo Guo Qiang


In this study, we demonstrate 4-channel coarse wavelength division multiplexing (CWDM) optical transceiver based on silicon photonics integrated circuits (PIC) of waveguide Ge-photodiode (Ge-PD) and Mach Zehnder (MZ)-modulator. 4-channel arrayed PICs of Ge-PD and MZ-modulator are verified to operate at 25 Gbps/ch achieving 4x25 Gbps of total data rate. 4 bare dies of single-channel commercial electronics ICs (EICs) of trans-impedance amplifier (TIA) for Ge-PD and driver IC for MZ-modulator are packaged with PIC on printed circuit board (PCB) in a chip-on-board (COB) manner. Each single-channel EIC is electrically connected to the one channel of 4-channel PICs by wire bonds to trace. The PICs have 4-channel multiplexer for MZ-modulator and 4-channel demultiplexer for Ge-PD. The 4-channel multiplexer/demultiplexer have echelle gratings for4 CWDM optic signals of which center wavelengths are 1511, 1531, 1553, and 1573 nm. Its insertion loss is around 4dB with over 15dB of extinction ratio.The dimension of 4-channel Ge-PD is 3.6x1.4x0.3mm, and its responsivity is 1A/W with dark current of less than 20 nA.Its measured 3dB bandwidth is around 20GHz. The dimension of the 4-channel MZ-modulator is 3.6x4.8x0.3mm, and its 3dB bandwidth is around 11Ghz at -2V of reverse biasing voltage. It has 2.4V•cmbyVπVL of 6V for π shift to 4 mm length modulator.5x5um of Inversed tapered mode size converter with less than 2dB of coupling loss is used for the coupling of the lensed fiber which has 5um of mode field diameter.The PCB for COB packaging and signal transmission is designed to have 6 layers in the hybrid layer structure. 0.25 mm-thick Rogers Duroid RT5880 is used as the first core dielectric layer for high-speed performance over 25 Gbps. It has 0.017 mm-thick of copper layers and its dielectric constant is 2.2and dissipation factor is 0.0009 at 10 GHz. The dimension of both single ended and differential microstrip transmission lines are calculated using full-wave electromagnetic (EM) field simulator HFSS which RF industry is using most. It showed 3dB bandwidth at around 15GHz in S-parameter measurement using network analyzer. The wire bond length for transmission line and ground connection from EIC is done to have less than 300 µm to minimize the parasitic effect to the system.Single layered capacitors (SLC) of 100pF and 1000pF are connected as close as possible to the EICs for stabilizing the DC biasing voltage by decoupling. Its signal transmission performance is under measurement at 25Gbps achieving 100Gbps by 4chx25Gbps. This work can be applied for the active optical cable (AOC) and quad small form-factor pluggable (QSFP) for high-speed optical interconnections. Its demands are quite large in data centers targeting 100 Gbps, 400 Gbps, and 1 Tbps. As the demands of high-speed AOC and QSFP for the application to intra/inter data centers increase, this silicon photonics based high-speed 4 channel CWDM scheme can have advantages not only in data throughput but also cost effectiveness since it reduces fiber cost dramatically through WDM.

Keywords: Communication System, Data center, Silicon Photonics, active optical cable(AOC), ge-photodiode, Mach Zehnder (MZ) modulator, optical interconnections, optical transceiver, photonics integrated circuits (PIC), quad small form-factor pluggable (QSFP)

Procedia PDF Downloads 258
1 Data Centers Temperature Profile Simulation Optimized by Finite Elements and Discretization Methods

Authors: Jose Alberto Garcia Fernandez, Zhimin Du, Xinqiao Jin


Nowadays, data center industry faces strong challenges for increasing the speed and data processing capacities while at the same time is trying to keep their devices a suitable working temperature without penalizing that capacity. Consequently, the cooling systems of this kind of facilities use a large amount of energy to dissipate the heat generated inside the servers, and developing new cooling techniques or perfecting those already existing would be a great advance in this type of industry. The installation of a temperature sensors matrix distributed in the structure of each server would provide the necessary information for collecting the required data for obtaining a temperature profile instantly inside them. However, the high number of temperature probes required to obtain the temperature profiles with sufficient accuracy is very high and expensive. Therefore, other less intrusive techniques are employed where each point that characterizes the server temperature profile is obtained by solving differential equations through simulation methods, simplifying data collection techniques, but increasing the time to obtain results. In order to reduce these calculation times, complicated and slow computational fluid dynamics simulations are replaced by simpler and faster finite element methods simulations which solve the Burgers' equations by backward, forward, and central discretization techniques after simplifying the energy and enthalpy conservation differential equations. The discretization methods employed for solving the first and second order derivatives of the obtained Burgers' equation after these simplifications are the key for obtaining results with greater or lesser accuracy regardless of the characteristic truncation error.

Keywords: Data center, FEM simulation, CFD simulation, temperature profile, Burgers' equations, discretization methods

Procedia PDF Downloads 1