{"title":"New Dynamic Constitutive Model for OFHC Copper Film","authors":"Jin Sung Kim, Hoon Huh","volume":88,"journal":"International Journal of Mechanical and Mechatronics Engineering","pagesStart":306,"pagesEnd":309,"ISSN":"1307-6892","URL":"https:\/\/publications.waset.org\/pdf\/9998030","abstract":"
The material properties of OFHC copper film was investigated with the High-Speed Material Micro Testing Machine (HSMMTM) at the high strain rates. The rate-dependent stress-strain curves from the experiment and the Johnson−Cook curve fitting showed large discrepancies as the plastic strain increases since the constitutive model implies no rate-dependent strain hardening effect. A new constitutive model was proposed in consideration of rate-dependent strain hardening effect. The strain rate hardening term in the new constitutive model consists of the strain rate sensitivity coefficients of the yield strength and strain hardening.