%0 Journal Article
	%A O. Bendermel and  C. Seladji and  M. Khaouani
	%D 2014
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 88, 2014
	%T Effect of Baffles on the Cooling of Electronic Components
	%U https://publications.waset.org/pdf/9997918
	%V 88
	%X In this work, we made anumerical study of the thermal and dynamic behavior of air in a horizontal channel with electronic components.The influenceto use baffles on the profiles of velocity and temperature is discussed.The finite volume method and the algorithm Simple are used for solving the equations of conservation of mass, momentum and energy.The results found show that baffles improve heat transfer between the cooling air and electronic components. The velocity will increase from 3 times per rapport of the initial velocity.

	%P 678 - 681