%0 Journal Article %A Wei Sun and Ruilin Zheng and Xuyuan Chen %D 2009 %J International Journal of Electrical and Computer Engineering %B World Academy of Science, Engineering and Technology %I Open Science Index 34, 2009 %T Three Dimensional MEMS Supercapacitor Fabricated by DRIE on Silicon Substrate %U https://publications.waset.org/pdf/12040 %V 34 %X Micro power sources are required to be used in autonomous microelectromechanical system (MEMS). In this paper, we designed and fabricated a three dimensional (3D) MEMS supercapacitor, which is consisting of conformal silicon dioxide/titanium/polypyrrole (PPy) layers on silicon substrate. At first, ''through-structure'' was fabricated on the silicon substrate by high-aspect-ratio deep reactive ion etching (DRIE) method, which enlarges the available surface area significantly. Then the SiO2/Ti/PPy layers grew sequentially on the ³through-structure´. Finally, the supercapacitor was investigated by electrochemical methods. %P 1785 - 1788