%0 Journal Article
	%A Ting-Chao Chen and  Yean-Ren Hwang and  Jing-Chie Lin
	%D 2013
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 74, 2013
	%T Continuity Microplating using Image Processing
	%U https://publications.waset.org/pdf/1061
	%V 74
	%X A real time image-guided electroplating system is
proposed in this paper. Unlike previous electroplating systems, instead
of using the intermittent mode to electroplate 500um long copper
specimen, a CCD camera and a motion controller are used to adjust
anode-cathode distance to obtain better results. Since the image of the
gap distance is highly deteriorated due to complex chemical-electrical
operation inside the electrolyte, to determine the gap distance, an
image processing algorithm is developed and mainly based on the
entropy and energy values. In addition, the color and incidence
direction of light source are also discussed to help the image process in
this paper. From the experiment results, the specimens created by the
proposed system show better structure, better uniformity and better
finishing surface compared to those by previous intermittent
electroplating setup.
	%P 207 - 212