%0 Journal Article
	%A Nao-Aki Noda and  Yu Zhang and  Ken-Tarou Takaishi and  Hiroyuki Shibahara
	%D 2011
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 55, 2011
	%T Intensity of Singular Stress Field at the Corner of Adhesive Layer in Bonded Plate
	%U https://publications.waset.org/pdf/10111
	%V 55
	%X In this paper the strength of adhesive joint under
tension and bending is discussed on the basis of intensity of
singular stress by the application of FEM. A useful method is
presented with focusing on the stress at the edge of interface
between the adhesive and adherent obtained by FEM. After
analyzing the adhesive joint strength with all material
combinations, it is found that to improve the interface strength,
thin adhesive layers are desirable because the intensity of
singular stress decreases with decreasing the thickness.
	%P 1388 - 1393