Kuan-Yu Chiu and Yin-Hsuan Chen and Tung-Han Chuang, Void-Free Bonding of Si/Ti/Ni Power Integrated Circuit Chips with Direct Bonding Copper Alumina Substrates through Ag3Sn Intermetallic Interlayer. journal = {International Journal of Materials and Metallurgical Engineering}, [online]. World Academy of Science, Engineering and Technology. December 2022, vol. 192(12). 141 - 146 [viewed 20 September 2024]. Available from: https://publications.waset.org/pdf/10012869.