Kuan-Yu Chiu and  Yin-Hsuan Chen and  Tung-Han Chuang,  Void-Free Bonding of Si/Ti/Ni Power Integrated Circuit Chips with Direct Bonding Copper Alumina Substrates through Ag3Sn Intermetallic Interlayer.   journal   = {International Journal of Materials and Metallurgical Engineering}, [online]. World Academy of Science, Engineering and Technology.
    December 2022, vol. 192(12). 141 - 146
    [viewed 10 May 2024]. Available from: https://publications.waset.org/pdf/10012869.