Chiu, K. , Chen, Y. , Chuang, T. (2022). 'Void-Free Bonding of Si/Ti/Ni Power Integrated Circuit Chips with Direct Bonding Copper Alumina Substrates through Ag3Sn Intermetallic Interlayer'. World Academy of Science, Engineering and Technology, Open Science Index 192, International Journal of Materials and Metallurgical Engineering, 16(12), 141 - 146.