WASET
	@article{(Open Science Index):https://publications.waset.org/pdf/10010857,
	  title     = {A Design of Anisotropic Wet Etching System to Reduce Hillocks on Etched Surface of Silicon Substrate},
	  author    = {Alonggot Limcharoen Kaeochotchuangkul and  Pathomporn Sawatchai},
	  country	= {},
	  institution	= {},
	  abstract     = {This research aims to design and build a wet etching system, which is suitable for anisotropic wet etching, in order to reduce etching time, to reduce hillocks on the etched surface (to reduce roughness), and to create a 45-degree wall angle (micro-mirror). This study would start by designing a wet etching system. There are four main components in this system: an ultrasonic cleaning, a condenser, a motor and a substrate holder. After that, an ultrasonic machine was modified by applying a condenser to maintain the consistency of the solution concentration during the etching process and installing a motor for improving the roughness. This effect on the etch rate and the roughness showed that the etch rate increased and the roughness was reduced.
},
	    journal   = {International Journal of Industrial and Manufacturing Engineering},
	  volume    = {13},
	  number    = {11},
	  year      = {2019},
	  pages     = {695 - 698},
	  ee        = {https://publications.waset.org/pdf/10010857},
	  url   	= {https://publications.waset.org/vol/155},
	  bibsource = {https://publications.waset.org/},
	  issn  	= {eISSN: 1307-6892},
	  publisher = {World Academy of Science, Engineering and Technology},
	  index 	= {Open Science Index 155, 2019},
	}