@article{(Open Science Index):https://publications.waset.org/pdf/10008313,
	  title     = {Study of Fast Etching of Silicon for the Fabrication of Bulk Micromachined MEMS Structures },
	  author    = {V. Swarnalatha and  A. V. Narasimha Rao and  P. Pal},
	  country	= {},
	  institution	= {},
	  abstract     = {The present research reports the investigation of fast etching of silicon for the fabrication of microelectromechanical systems (MEMS) structures using silicon wet bulk micromachining. Low concentration tetramethyl-ammonium hydroxide (TMAH) and hydroxylamine (NH2OH) are used as main etchant and additive, respectively. The concentration of NH2OH is varied to optimize the composition to achieve best etching characteristics such as high etch rate, significantly high undercutting at convex corner for the fast release of the microstructures from the substrate, and improved etched surface morphology. These etching characteristics are studied on Si100 and Si110 wafers as they are most widely used in the fabrication of MEMS structures as wells diode, transistors and integrated circuits.},
	    journal   = {International Journal of Materials and Metallurgical Engineering},
	  volume    = {11},
	  number    = {12},
	  year      = {2017},
	  pages     = {823 - 826},
	  ee        = {https://publications.waset.org/pdf/10008313},
	  url   	= {https://publications.waset.org/vol/132},
	  bibsource = {https://publications.waset.org/},
	  issn  	= {eISSN: 1307-6892},
	  publisher = {World Academy of Science, Engineering and Technology},
	  index 	= {Open Science Index 132, 2017},
	}