{"title":"Experimental Study on Slicing of Sapphire with Fixed Abrasive Diamond Wire Saw","authors":"Mengjun Zhang, Yuli Sun, Dunwen Zuo, Chunxiang Xie, Chunming Zhang","volume":101,"journal":"International Journal of Mechanical and Mechatronics Engineering","pagesStart":727,"pagesEnd":731,"ISSN":"1307-6892","URL":"https:\/\/publications.waset.org\/pdf\/10001154","abstract":"
Experimental study on slicing of sapphire with fixed
\r\nabrasive diamond wire saw was conducted in this paper. The process
\r\nparameters were optimized through orthogonal experiment of three
\r\nfactors and four levels. The effects of wire speed, feed speed and
\r\ntension pressure on the surface roughness were analyzed. Surface
\r\nroughness in cutting direction and feed direction were both detected.
\r\nThe results show that feed speed plays the most significant role on the
\r\nsurface roughness of sliced sapphire followed by wire speed and
\r\ntension pressure. The optimized process parameters are as follows:
\r\nwire speed 1.9 m\/s, feed speed 0.187 mm\/min and tension pressure
\r\n0.18 MPa. In the end, the results were verified by analysis of variance.<\/p>\r\n","references":"[1] A. Azhdari, S. Nemat-nasser, J. Rome, \u201cExperimental observations and\r\ncomputational modeling of fracturing in an anisotropic brittle crystal\r\n(sapphire),\u201dInt J Fracture, vol. 94, pp. 251-266, Mar. 1998.\r\n[2] S. M. Hosseini, H. A. R. Aliabad, A. Kompany, \u201cFirst-principles study of\r\nthe optical properties of pure \u03b1-Al2O3 and La aluminates,\u201d Eur Phys J B,\r\nvol. 43, pp. 439-444, Apr. 2005.\r\n[3] C. H. Chung, G. D. Tsay, M. H. Tsai, \u201cDistribution of diamond grains in\r\nfixed abrasive wire sawing process,\u201d Int J Adv Manuf Tech, vol. 73, pp.\r\n1485-1494, Sept. 2014.\r\n[4] D. Kray, M. Schumann, A. Eyer, G. Willeke, R. Kubler, et al, \u201cSolar\r\nwafer slicing with loose and fixed grains,\u201d in Conf. Rec.2006 IEEE 4th\r\nworld conference on photovoltaic energy conversion,Waikooloa, 2007,\r\npp. 948-951.\r\n[5] W. Clark, A. Shih, C. Hardin, S. McSpadden, \u201cFixed abrasive diamond\r\nwire machining- part i: process monitoring and wire tension force,\u201d Int J\r\nAdv Manuf Syst, vol. 43, pp. 523-532, May. 2003.\r\n[6] W. Clark, A. Shih, R. Lemaster, S. McSpadden, \u201cFixed abrasive diamond\r\nwire machining- part ii: experiments design and results,\u201d Int J Adv Manuf\r\nSyst, vol. 43, pp. 533-542, May. 2003.\r\n[7] E. Teomete, \u201cInvestigation of long waviness induced by the wire saw\r\nprocess,\u201d Proceedings of the Institution of Mechanical Engineers. B J\r\nEng Manuf, vol. 225, pp. 1153-1162, Jul. 2011.\r\n[8] G. Fu, A. Chandra and S. Guha\uff0c\u201cA plasticity-based model of material\r\nremoval in chemical-mechanical polishing (CMP),\u201d IEEE Trans.\r\nSemicond. Manuf., vol. 14, pp. 406-417, Apr. 2001.\r\n[9] E. Teomete. \u201cRoughness damage evolution due to wire saw process,\u201d Int.\r\nJ. Precis. Eng. Manuf., vol. 12, pp. 941-947, Jun. 2011.\r\n[10] Hardin and W. Craig, \u201cFixed Abrasive Diamond Wire Saw Slicing of\r\nSingle Crystal SiC Wafers and Wood',\u201d Master degree thesis, North\r\nCarolina State University, USA, 2003.","publisher":"World Academy of Science, Engineering and Technology","index":"Open Science Index 101, 2015"}