M. Z. Abdullah

Publications

1 Experimental Investigation and Optimization of Nanoparticle Mass Concentration and Heat Input of Loop Heat Pipe

Authors: Nur Irmawati, P. Gunnasegaran, M. Z. Abdullah, M. Z. Yusoff

Abstract:

This study presents experimental and optimization of nanoparticle mass concentration and heat input based on the total thermal resistance (Rth) of loop heat pipe (LHP), employed for PCCPU cooling. In this study, silica nanoparticles (SiO2) in water with particle mass concentration ranged from 0% (pure water) to 1% is considered as the working fluid within the LHP. The experimental design and optimization is accomplished by the design of experimental tool, Response Surface Methodology (RSM). The results show that the nanoparticle mass concentration and the heat input have significant effect on the Rth of LHP. For a given heat input, the Rth is found to decrease with the increase of the nanoparticle mass concentration up to 0.5% and increased thereafter. It is also found that the Rth is decreased when the heat input is increased from 20W to 60W. The results are optimized with the objective of minimizing the Rth, using Design-Expert software, and the optimized nanoparticle mass concentration and heat input are 0.48% and 59.97W, respectively, the minimum thermal resistance being 2.66 (ºC/W).

Keywords: Nanofluid, Optimization, loop heat pipe, thermal resistance

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Abstracts

2 Virtual Prototyping of LED Chip Scale Packaging Using Computational Fluid Dynamic and Finite Element Method

Authors: M. Z. Abdullah, R. C. Law, Shirley Kang, T. Y. Hin

Abstract:

LED technology has been evolving aggressively in recent years from incandescent bulb during older days to as small as chip scale package. It will continue to stay bright in future. As such, there is tremendous pressure to stay competitive in the market by optimizing products to next level of performance and reliability with the shortest time to market. This changes the conventional way of product design and development to virtual prototyping by means of Computer Aided Engineering (CAE). It comprises of the deployment of Finite Element Method (FEM) and Computational Fluid Dynamic (CFD). FEM accelerates the investigation for early detection of failures such as crack, improve the thermal performance of system and enhance solder joint reliability. CFD helps to simulate the flow pattern of molding material as a function of different temperature, molding parameters settings to evaluate failures like voids and displacement. This paper will briefly discuss the procedures and applications of FEM in thermal stress, solder joint reliability and CFD of compression molding in LED CSP. Integration of virtual prototyping in product development had greatly reduced the time to market. Many successful achievements with minimized number of evaluation iterations required in the scope of material, process setting, and package architecture variant have been materialized with this approach.

Keywords: LED, virtual prototyping, Computational Fluid Dynamic (CFD), chip scale packaging (CSP)

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1 Experimental Investigation and Optimization of Nanoparticle Mass Concentration and Heat Input of Loop Heat Pipe

Authors: Nur Irmawati, P. Gunnasegaran, M. Z. Abdullah, M. Z. Yusoff

Abstract:

This study presents experimental and optimization of nanoparticle mass concentration and heat input based on the total thermal resistance (Rth) of loop heat pipe (LHP), employed for PC-CPU cooling. In this study, silica nanoparticles (SiO2) in water with particle mass concentration ranged from 0% (pure water) to 1% is considered as the working fluid within the LHP. The experimental design and optimization is accomplished by the design of the experimental tool, Response Surface Methodology (RSM). The results show that the nanoparticle mass concentration and the heat input have a significant effect on the Rth of LHP. For a given heat input, the Rth is found to decrease with the increase of the nanoparticle mass concentration up to 0.5% and increased thereafter. It is also found that the Rth is decreased when the heat input is increased from 20W to 60W. The results are optimized with the objective of minimizing the Rt, using Design-Expert software, and the optimized nanoparticle mass concentration and heat input are 0.48% and 59.97W, respectively, the minimum thermal resistance being 2.66(ºC/W).

Keywords: Nanofluid, Optimization, Thermal Resistance, loop heat pipe

Procedia PDF Downloads 256