Using Printing Method and Post Heat Treatment to Fabricate CIS Absorber Layer
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Using Printing Method and Post Heat Treatment to Fabricate CIS Absorber Layer

Authors: Mao-An Chen, Chien-Chen Diao, Chia-Cheng Huang, Chin-Guo Kuo, Cheng-Fu Yang, Yen-Lin Chen

Abstract:

In this study, the Mo-electrode thin films were deposited using two-stepped process and the high purity copper indium selenide-based powder (CuInSe2, CIS) was fabricated by using hydrothermal process by Nanowin Technology Co. Ltd. Because the CIS powder was aggregated into microscale particles, the CIS power was ground into nano-scale particles. 6 wt% CIS particles were mixed and dispersed into isopropyl alcohol (IPA). A new non-vacuum thin-film deposition process, spray coating method (SPM), was investigated to deposit the high-densified CIS absorber layers. 0.1 ml CIS solution was sprayed on the 20 mm×10 mm Mo/glass substrates and then the CuInSe2 thin films were annealed in a selenization furnace using N2 as atmosphere. The annealing temperature and time were set at 550oC and 5 min, and 0.0g~0.6g extra Se content was added in the furnace. The influences of extra Se content on the densification, crystallization, resistivity (ρ), hall mobility (μ), and carrier concentration of the CIS absorber layers were well investigated in this study.

Keywords: CuInSe2, isopropyl alcohol, spray coating method, annealing, selenization process.

Digital Object Identifier (DOI): doi.org/10.5281/zenodo.1093668

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