Sheng-Ming Huang and Nan-Chyuan Tsai and Chih-Che Lin and Chun-Chi Lin
Intelligent FaceUp CMP System Integrated with OnLine Optical Measurements
1682 - 1688
2013
7
12
International Journal of Physical and Mathematical Sciences
https://publications.waset.org/pdf/9996718
https://publications.waset.org/vol/84
World Academy of Science, Engineering and Technology
An innovative design for intelligent Chemical Mechanical Polishing (CMP) system is proposed and verified by experiments in this report. Online measurement and realtime feedback are integrated to eliminate the shortcomings of traditional approaches, e.g., the batchtobatch discrepancy of required polishing time, over consumption of chemical slurry, and nonuniformity across the wafer. The major advantage of the proposed method is that the finish of local surface roughness can be consistent, no matter where the innerring region or outerring region is concerned. Secondly, it is able to eliminate the Edge effect. Conventionally, the interfacial induced stress near the wafer edge is generally much higher than that near the wafer center. At last, by using the proposed intelligent chemical mechanical polishing strategy, the cost of the entire machining cycle can be much reduced while the quality of the finished goods certainly upgraded.
Open Science Index 84, 2013