@article{(Open Science Index):https://publications.waset.org/pdf/9996639, title = {Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow}, author = {Arijit Roy}, country = {}, institution = {}, abstract = {Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis. }, journal = {International Journal of Electronics and Communication Engineering}, volume = {7}, number = {8}, year = {2013}, pages = {1122 - 1126}, ee = {https://publications.waset.org/pdf/9996639}, url = {https://publications.waset.org/vol/80}, bibsource = {https://publications.waset.org/}, issn = {eISSN: 1307-6892}, publisher = {World Academy of Science, Engineering and Technology}, index = {Open Science Index 80, 2013}, }