Satyanarayana and K.N. Prabhu, Study of Reactive Wetting of Sn–0.7Cu and Sn–0.3Ag–0.7Cu Lead Free Solders during Solidification on Nickel Coated Al Substrates. journal = {International Journal of Materials and Metallurgical Engineering}, [online]. World Academy of Science, Engineering and Technology. January 2013, vol. 73(1). 25 - 28 [viewed 19 September 2024]. Available from: https://publications.waset.org/pdf/9580.