Guang Sun and  Yong Li and  Yuanyuan Zhang and  Shijun Lin and  Li Su and  Depeng Jin and  Lieguang zeng,  Dual-Link Hierarchical Cluster-Based Interconnect Architecture for 3D Network on Chip.   journal   = {International Journal of Electronics and Communication Engineering}, [online]. World Academy of Science, Engineering and Technology.
    September 2010, vol. 45(9). 1388 - 1392
    [viewed 25 April 2024]. Available from: https://publications.waset.org/pdf/6553.