WASET
    MK Lee and  JS Hong and  SM Sin and  HU Oh,  Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment.   journal   = {International Journal of Mechanical and Mechatronics Engineering}, [online]. World Academy of Science, Engineering and Technology.
    October 2010, vol. 46(10). 1030 - 1034
    [viewed 25 April 2024]. Available from: https://publications.waset.org/pdf/5644.