%0 Journal Article
	%A MK Lee and  JS Hong and  SM Sin and  HU Oh
	%D 2010
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 46, 2010
	%T Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment
	%U https://publications.waset.org/pdf/5644
	%V 46
	%X Heat pipes are used to control the thermal problem for
electronic cooling. It is especially difficult to dissipate heat to a heat
sink in an environment in space compared to earth. For solving this
problem, in this study, the Poiseuille (Po) number, which is the main
measure of the performance of a heat pipe, is studied by CFD; then, the
heat pipe performance is verified with experimental results. A heat
pipe is then fabricated for a spatial environment, and an in-house code
is developed. Further, a heat pipe subsystem, which consists of a heat
pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and
radiator, is tested and correlated with the TMM (Thermal
Mathematical Model) through a commercial code. The correlation
results satisfy the 3K requirement, and the generated thermal model is
verified for application to a spatial environment.
	%P 1030 - 1034