@article{(Open Science Index):https://publications.waset.org/pdf/5644, title = {Development of Thermal Model by Performance Verification of Heat Pipe Subsystem for Electronic Cooling under Space Environment}, author = {MK Lee and JS Hong and SM Sin and HU Oh}, country = {}, institution = {}, abstract = {Heat pipes are used to control the thermal problem for electronic cooling. It is especially difficult to dissipate heat to a heat sink in an environment in space compared to earth. For solving this problem, in this study, the Poiseuille (Po) number, which is the main measure of the performance of a heat pipe, is studied by CFD; then, the heat pipe performance is verified with experimental results. A heat pipe is then fabricated for a spatial environment, and an in-house code is developed. Further, a heat pipe subsystem, which consists of a heat pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and radiator, is tested and correlated with the TMM (Thermal Mathematical Model) through a commercial code. The correlation results satisfy the 3K requirement, and the generated thermal model is verified for application to a spatial environment.}, journal = {International Journal of Mechanical and Mechatronics Engineering}, volume = {4}, number = {10}, year = {2010}, pages = {1030 - 1034}, ee = {https://publications.waset.org/pdf/5644}, url = {https://publications.waset.org/vol/46}, bibsource = {https://publications.waset.org/}, issn = {eISSN: 1307-6892}, publisher = {World Academy of Science, Engineering and Technology}, index = {Open Science Index 46, 2010}, }