TY - JFULL AU - S. Y. Choi and Y. H. Na and J. H. Kim PY - 2009/9/ TI - Thermoelastic Damping of Inextensional Hemispherical Shell T2 - International Journal of Mechanical and Mechatronics Engineering SP - 891 EP - 897 VL - 3 SN - 1307-6892 UR - https://publications.waset.org/pdf/3710 PU - World Academy of Science, Engineering and Technology NX - Open Science Index 32, 2009 N2 - In this work, thermoelastic damping effect on the hemi- spherical shells is investigated. The material is selected silicon, and heat conduction equation for thermal flow is solved to obtain the temperature profile in which bending approximation with inextensional assumption of the model. Using the temperature profile, eigen-value analysis is performed to get the natural frequencies of hemispherical shells. Effects of mode numbers, radii and radial thicknesses of the model on the natural frequencies are analyzed in detail. Furthermore, the quality factor (Q-factor) is defined, and discussed for the ring and hemispherical shell. ER -