WASET
    Raed A. Amro,  Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends.   journal   = {International Journal of Electrical and Computer Engineering}, [online]. World Academy of Science, Engineering and Technology.
    January 2009, vol. 25(1). 41 - 44
    [viewed 24 April 2024]. Available from: https://publications.waset.org/pdf/2941.