%0 Journal Article
	%A Y. Kobayashi and  T. Shirochi and  Y. Yasuda and  T. Morita
	%D 2013
	%J International Journal of Materials and Metallurgical Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 82, 2013
	%T Preparation of Metallic Copper Nanoparticles by Reduction of Copper Ions in Aqueous Solution and Their Metal-Metal Bonding Properties
	%U https://publications.waset.org/pdf/17215
	%V 82
	%X This paper describes a method for preparing metallic Cu nanoparticles in aqueous solution, and a metal-metal bonding technique using the Cu particles.Preparation of the Cu particle colloid solution was performed in water at room temperature in air using a copper source (0.01 M Cu(NO3)2), a reducing reagent (0.2 - 1.0 M hydrazine), and stabilizers (0.5×10-3 M citric acid and 5.0×10-3 M cetyltrimethylammonium bromide). The metallic Cu nanoparticles with sizes of ca. 60nm were prepared at all the hydrazine concentrations examined. A stage and a plate of metallic Cu were successfully bonded under annealing at 400oC and pressurizing at 1.2 MPa for 5min in H2 gas with help of the metallic Cu particles. A shear strength required for separating the bonded Cu substrates reached the maximum value at a hydrazine concentration of 0.8M, and it decreased beyond the concentration. Consequently, the largest shear strength of 22.9 MPa was achieved at the 0.8 M hydrazine concentration.

	%P 769 - 772