%0 Journal Article
	%A Wei Sun and  Ruilin Zheng and  Xuyuan Chen
	%D 2009
	%J International Journal of Electrical and Computer Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 34, 2009
	%T Three Dimensional MEMS Supercapacitor Fabricated by DRIE on Silicon Substrate
	%U https://publications.waset.org/pdf/12040
	%V 34
	%X Micro power sources are required to be used in autonomous microelectromechanical system (MEMS). In this paper, 
we designed and fabricated a three dimensional (3D) MEMS supercapacitor, which is consisting of conformal silicon 
dioxide/titanium/polypyrrole (PPy) layers on silicon substrate. At first, ''through-structure'' was fabricated on the silicon substrate by high-aspect-ratio deep reactive ion etching (DRIE) method, which enlarges the available surface area significantly. Then the SiO2/Ti/PPy layers grew sequentially on the ³through-structure´. Finally, the supercapacitor was investigated by electrochemical methods.

	%P 1785 - 1788