%0 Journal Article
	%A M.C. Zaghdoudi and  S. Maalej and  J. Mansouri and  M.B.H. Sassi
	%D 2011
	%J International Journal of Mechanical and Mechatronics Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 51, 2011
	%T Flat Miniature Heat Pipes for Electronics Cooling: State of the Art, Experimental and Theoretical Analysis
	%U https://publications.waset.org/pdf/10387
	%V 51
	%X An experimental study is realized in order to verify the
Mini Heat Pipe (MHP) concept for cooling high power dissipation
electronic components and determines the potential advantages of
constructing mini channels as an integrated part of a flat heat pipe. A
Flat Mini Heat Pipe (FMHP) prototype including a capillary structure
composed of parallel rectangular microchannels is manufactured and
a filling apparatus is developed in order to charge the FMHP. The
heat transfer improvement obtained by comparing the heat pipe
thermal resistance to the heat conduction thermal resistance of a
copper plate having the same dimensions as the tested FMHP is
demonstrated for different heat input flux rates. Moreover, the heat
transfer in the evaporator and condenser sections are analyzed, and
heat transfer laws are proposed. In the theoretical part of this work, a
detailed mathematical model of a FMHP with axial microchannels is
developed in which the fluid flow is considered along with the heat
and mass transfer processes during evaporation and condensation.
The model is based on the equations for the mass, momentum and
energy conservation, which are written for the evaporator, adiabatic,
and condenser zones. The model, which permits to simulate several
shapes of microchannels, can predict the maximum heat transfer
capacity of FMHP, the optimal fluid mass, and the flow and thermal
parameters along the FMHP. The comparison between experimental
and model results shows the good ability of the numerical model to
predict the axial temperature distribution along the FMHP.
	%P 714 - 737