Commenced in January 2007
Frequency: Monthly
Edition: International
Paper Count: 30455
Design of Reliable and Low Cost Substrate Heater for Thin Film Deposition

Authors: Ali Eltayeb Muhsin, Mohamed Elhadi Elsari


The substrate heater designed for this investigation is a front side substrate heating system. It consists of 10 conventional tungsten halogen lamps and an aluminum reflector, total input electrical power of 5 kW. The substrate is heated by means of a radiation from conventional tungsten halogen lamps directed to the substrate through a glass window. This design allows easy replacement of the lamps and maintenance of the system. Within 2 to 6 minutes the substrate temperature reaches 500 to 830 C by varying the vertical distance between the glass window and the substrate holder. Moreover, the substrate temperature can be easily controlled by controlling the input power to the system. This design gives excellent opportunity to deposit many deferent films at deferent temperatures in the same deposition time. This substrate heater was successfully used for Chemical Vapor Deposition (CVD) of many thin films, such as Silicon, iron, etc.

Keywords: Thin Films, CVD, Halogen Lamp, Substrate Heater

Digital Object Identifier (DOI):

Procedia APA BibTeX Chicago EndNote Harvard JSON MLA RIS XML ISO 690 PDF Downloads 2394


[1] F. Incropera and D. DeWitt, "Fundamentals of Heat and Mass Transfer", John Willy & Sons, 5th.ed. , 2001.
[2] Matthew Sweetland, John H. Lienhard V, "Rapid IR Heating of Electronic Components in the Testing Cycle", Proc. 35th National Heat Transfer Conf., California, 2001.
[3] J. Y. Choi, H. M. Do, "A learning Approach of Wafer Temperature Control in Rapid Thermal Processing System", IEEE Trans. Semiconductor Manufacturing, vol. 14, No. 1, Feb. 2001.
[4] P. Xu, J. Shao, Y. Yen, "Experimental Study of Substrate Temperature", Applied Optics, Vol. 28, No. 14, July 1989.
[5] S. Hung, C. Chao, C. Hsu, "Lamp Design for Fast Cooling of Rapid Thermal Processes with a Two-Zone Lamp Using a Step Cooling Process", Semicond. Sci. and Technol. 20, 72-79, 2005.
[6] A. Bouteville, "Numerical Simulation Applied to Chemical Vapor Deposition Process. Rapid Thermal CVD and Spray CVD", J. Optoelectron. Adv. Mater. Vol. 7, No. 2, 599-606, April 2005.
[7] M. Lindstam, M. Boman, K. Piglmayer, "Halogen Lamp-assisted High Rate Deposition of both Hard and Elastic Carbon Films from CH2I2", Nucl. Instr. and Meth. In Phys. B 192, 274-279, 2002.
[8] P. Logerais, M. Girtan. A. Bouteville, "RTLPCVD Modeling: Steadystate Simulations", (EUROCVD-15, Bochum, Germany), ECS Proceeding Vol. 2005-09, 49-56, 2005.
[9] S. Krumidieck and H. Jung, "Substrate Heater Design Investigation for Uniform Temperature in a Cold-Wall Low Pressure Reactor", (EUROCVD-15, Bochum, Germany), ECS Proceeding Vol. 2005-09, 13-20, 2005.
[10] Travis L. Turner and Robert L. Ash, "Numerical and Experimental Analyses of the Radiant Heat Flux Produced by Quartz Heating Systems", NASA Technical Paper 3387, March 1994.
[11] S. A. Norman, C. Schaper, and S. Boyd, "Improvement of Temperature Uniformity in Rapid Thermal Processing Systems using Multivariable Control", Mat. Res. Soc. Proc., 1991.
[12] M. Pettersson, S. Stenstrom, "Modeling of an electric IR heater at transient and steady state conditions Part II: Modeling a paper dryer", Intl. J. Heat Mass Trans., 43, 1223-1232, 2000.
[13] H. Chang, R. A. Adomaitisa, J. Kidder and G. Rubloff, "Influence of gas composition on wafer temperature in a tungsten chemical vapor deposition reactor: Experimental measurements, model development, and parameter identification", J. Vac. Sci. Technol. B, Vol. 19, No. 1, Jan./Feb 2001.
[14] M. Lindstam, O. Wanstrand, M. Boman and K. Piglmayer, "Mechanical and tribological aspects on a-C films deposited by lamp assisted chemical vapor deposition", Surf. Coat. Technol. 138, 264-268, 2001.
[15] A. T. Fiory "Methods in Rapid thermal Annealing", Proceedings of RTP 2000, 8th. Int. Conf. on Advanced Thermal Processing of Semiconductors, Sept. 20 - 22, 15-25, 2000.
[16] S. Moralesi and B. Dahhous, "Temperature uniformity in RTP using MIMO Adaptive Control", Int. J. Adapt. Control Signal Process. 12, 227-245, 1998.