%0 Journal Article
	%A Alonggot Limcharoen Kaeochotchuangkul and  Pathomporn Sawatchai
	%D 2019
	%J International Journal of Industrial and Manufacturing Engineering
	%B World Academy of Science, Engineering and Technology
	%I Open Science Index 155, 2019
	%T A Design of Anisotropic Wet Etching System to Reduce Hillocks on Etched Surface of Silicon Substrate
	%U https://publications.waset.org/pdf/10010857
	%V 155
	%X This research aims to design and build a wet etching system, which is suitable for anisotropic wet etching, in order to reduce etching time, to reduce hillocks on the etched surface (to reduce roughness), and to create a 45-degree wall angle (micro-mirror). This study would start by designing a wet etching system. There are four main components in this system: an ultrasonic cleaning, a condenser, a motor and a substrate holder. After that, an ultrasonic machine was modified by applying a condenser to maintain the consistency of the solution concentration during the etching process and installing a motor for improving the roughness. This effect on the etch rate and the roughness showed that the etch rate increased and the roughness was reduced.

	%P 674 - 677