@article{(Open Science Index):https://publications.waset.org/pdf/10008773, title = {The Grinding Influence on the Strength of Fan-Out Wafer-Level Packages}, author = {Z. W. Zhong and C. Xu and W. K. Choi}, country = {}, institution = {}, abstract = {To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.}, journal = {International Journal of Electronics and Communication Engineering}, volume = {12}, number = {3}, year = {2018}, pages = {213 - 216}, ee = {https://publications.waset.org/pdf/10008773}, url = {https://publications.waset.org/vol/135}, bibsource = {https://publications.waset.org/}, issn = {eISSN: 1307-6892}, publisher = {World Academy of Science, Engineering and Technology}, index = {Open Science Index 135, 2018}, }