WASET
	@article{(Open Science Index):https://publications.waset.org/pdf/10008773,
	  title     = {The Grinding Influence on the Strength of Fan-Out Wafer-Level Packages},
	  author    = {Z. W. Zhong and  C. Xu and  W. K. Choi},
	  country	= {},
	  institution	= {},
	  abstract     = {To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.},
	    journal   = {International Journal of Electronics and Communication Engineering},
	  volume    = {12},
	  number    = {3},
	  year      = {2018},
	  pages     = {213 - 216},
	  ee        = {https://publications.waset.org/pdf/10008773},
	  url   	= {https://publications.waset.org/vol/135},
	  bibsource = {https://publications.waset.org/},
	  issn  	= {eISSN: 1307-6892},
	  publisher = {World Academy of Science, Engineering and Technology},
	  index 	= {Open Science Index 135, 2018},
	}