B. Arzhanov and  A. Correia and  P. Delgado and  J. Meireles,  Thermal Evaluation of Printed Circuit Board Design Options and Voids in Solder Interface by a Simulation Tool.   journal   = {International Journal of Mechanical and Mechatronics Engineering}, [online]. World Academy of Science, Engineering and Technology.
    January 2016, vol. 111(3). 494 - 505
    [viewed 26 April 2024]. Available from: https://publications.waset.org/pdf/10003817.